SFB 694:  Integration of Electronic Components into Mobile Systems

• Subject Area: Mechanical and Industrial Engineering ; Computer Science, Systems and Electrical Engineering ; Materials Science and Engineering
• Term: from 2006 to 2010
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 14413796

The long-term research programme of the Collaborative Research Centre is to develop fundamental knowledge and scientific methods for the economical production of electronic components and the functional integration of the components into harsh environments in mobile systems to ensure an improvement of component reliability for these applications. The Collaborative Research Centre focusses on cross-disciplinary research in fundamental research projects within the research areas: mechanical engineering and manufacturing technology, electrical and electronic engineering, quality management and metrology as well as information technology and computer sciences. The vision of the Collaborative Research Centre is to integrate electronic components into sensors and actors, which will be applied in harsh environments in automotive applications. Thus, the structural complexity of control units in automotive applications will be reduced and the reliability of electronic components will be significantly improved.
Innovative manufacturing processes and methods will enable flexible and economical series production of electronic systems out of a reduced variety of electronic components.
The long-term research programme is reflected in the structure of the Collaborative Research Centre with three project groups: A "Processes", B "Systems", C "Quality Assurance". The project group A "Processes" focusses on fundamental research in the field of manufacturing processes for embedded electro-mechanical components with special focus on applications in mobile systems.
The project group "Systems" investigates new concepts for the development of innovative embedded electro-mechanical modules and systems. In the project group "Quality Assurance" comprehensive strategies and specific methods and tools for quality assurance and quality control for manufacturing and integration technologies as well as for embedded electro-mechanical modules are being established.

• DFG Programme: Collaborative Research Centres
• International Connection: Switzerland

Completed projects

• A01 - Embedding Stereolithography - Prozessentwicklung zur Integration von Funktionselementen in mikromechatronischen Baugruppen (Project Heads Otto, Andreas ;  Schmidt, Michael )
• A02 - Umformtechnische Herstellung komplexer metallischer Komponenten (Project Head Engel, Ulf )
• A03 - Virtuelles Qualitätsmanagement: Integration statistischer Qualitätsmanagement-Methoden in simulierte Prozessketten (Project Head Weckenmann, Albert )
• A04 - Laserbasierte Fügeverfahren für die flexible Fertigung integrierter Systeme (Project Heads Geiger, Manfred ;  Schmidt, Michael )
• A05 - Spritzgießen multipolarer kunststoffgebundener Mikromagnete (Project Heads Ehrenstein, Gottfried W. ;  Gehde, Michael )
• A07 - Assembly moulding of mechatronic Systems (Project Heads Brocka-Krzeminska, Zaneta ;  Drummer, Dietmar ;  Ehrenstein, Gottfried W. )
• B01 - Integrative Produktionstechnologien für dezentrale Elektronikbaugruppen (Project Head Feldmann, Klaus )
• B02 - Integrierte dreidimensionale multifunktionale Antennensysteme für Sicherheits- und Kommunikationssysteme in Fahrzeugen (Project Heads Gehde, Michael ;  Schmidt, Lorenz-Peter )
• B03 - Thermisches Management funktionelle Bauelemente für die Systemintegration (Project Heads Ehrenstein, Gottfried W. ;  Gehde, Michael )
• B04 - Motorintegrierte Leistungselektronik: Strukturflexibel mechatronisch integrierbare passive elektronische Bauelemente (Project Heads März, Martin ;  Ryssel, Heiner )
• B05 - Fertigungsorientierte Entwurfsmethodik für Software eingebettet in Komponenten mobiler Systeme (Project Head Teich, Jürgen )
• B06 - Erzeugung mechatronischer Systeme mittels Montagespritzgießen (Project Heads Brocka-Krzeminska, Zaneta ;  Schmachtenberg, Ernst )
• C01 - Qualität und Zuverlässigkeit von elektronischen Baugruppen mit erhöhten Anforderungsprofilen (Project Head Feldmann, Klaus )
• C02 - Multisensorielle Prüfung eingebetteter Baugruppen (Project Head Weckenmann, Albert )
• C04 - Integrierbare Bauelemente zur Erhöhung der Betriebssicherheit elektronischer Systemkomponenten im Automobil (Project Heads Frey, Lothar ;  Ryssel, Heiner )
• T01 - Untersuchungen zur Herstellung eines Encoders auf Basis kunststoffgebundener Dauermagnete im Montagespritzgießverfahren (Project Head Drummer, Dietmar )
• Z - Zentrale Aufgaben des Sonderforschungsbereichs (Project Head Weckenmann, Albert )

• Applicant Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg
• Participating Institution: Bayerisches Laserzentrum (BLZ) GmbH; Fraunhofer-Institut für Integrierte Schaltungen (IIS); Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
• Spokesperson: Professor Dr.-Ing. Albert Weckenmann