GRK 1215:  Materialien und Konzepte für fortschrittliche Metallisierungssysteme

• Fachliche Zuordnung: Systemtechnik
• Förderung: Förderung von 2006 bis 2015
• Projektkennung: Deutsche Forschungsgemeinschaft (DFG) - Projektnummer 883210

• Erstellungsjahr: 2015

Zusammenfassung der Projektergebnisse

The reported IRTG was a joint International PhD program between the Faculty of Natural Sciences and the Faculty of Electrical Engineering and Information Technology of Chemnitz University of Technology, Berlin Technical University, the Fraunhofer Institute for Reliability and Microintegration (IZM) Berlin, the Fraunhofer Institute for Electronic Nano Systems (ENAS) Chemnitz, as well as two Chinese universities, the Fudan University, Shanghai and the Shanghai Jiao Tong University. Continuously shrinking dimensions of semiconductor devices and the progressive approach to fundamental physical limitations are calling for novel materials, sophisticated analysis techniques and advanced manufacturing processes applicable to industrial mass production. The International Research Training Group "Materials and Concepts for Advanced Interconnects and Nanosystems" therefore treated the tremendous challenges related to the formation of the electrical interconnects between single transistors as well as between functional blocks or stacked dies to form complex metallization systems on a single chip or in a multi-chip stack. Moreover nanostructures and nanomaterials were the focus of the scientific work. The research work was performed in the fields of new material development, advanced processes and technologies, process and material interactions, integration aspects, material and test structure characterization, and material, process, and device modelling/simulation. Activities included both fundamental and applied research, as well as reliability and interconnect scaling issues, and the evaluation of manufacturing-worthy advanced materials and nanoscale devices. Highlighting links between basic materials properties, their characteristics in nanostructures, technological aspects of materials and their applications was a major objective of the program. Additionally, novel concepts related to new device approaches such as magnetic nanostructures or nanostructures for energy storage were investigated. The multidisciplinarity of this project enabled a really fruitful cooperation between the PhD students. A case in point is the cooperation between the PhD students in chemistry and the students who developed atomic layer deposition processes. With a new Cu-precursor, developed from the chemist, a new atomic layer deposition process for CuOx could be developed with a following reduction step to pure Cu. This resulted in a patent. Nevertheless, the precursor have been further improved with the experience from the deposition experiments. It was seen, that the CuOx layer was reduced more effective when it deposited onto Ru layer. So a small amount of Ru has been added to the Cu precursor like a catalytic effect for better reduction. This work resulted also in a patent. Strong collaboration existed also between the students for simulation and modelling and the students who worked with Carbon nano tubes (CNTs). Here, the conclusion didn't have direct influence on the experimental work, but the understanding of the experimental results could be improved. A really important result of simulation was the comprehension of the electron transfer between the CNT and the metallic pad, and which metals are better suitable as metallic pad for higher electron transfer. Further students worked rather on fundamental subjects, like the mechanical description of materials as thin films by nanoindentation. The evaluation of mechanical properties of thin layers, especially in a multi-layer structure, poses challenges. The works in this topic contributed to a deep understanding which stylus form and parameters (forces and normal / lateral loads) leads to different intrinsic stress fields in the layers and how you could extract the mechanical film properties from these data. In the renewal proposal the topic was extended to nano-systems which address the energy storage or energy generation in smart systems. On one hand side rolled up nanostructures were investigated as electrode materials in lithium ion batteries which can be directly fabricated on wafer level. On the other hand side one project dealt with thermoelectricity, where polymer systems with embedded nanostructures should increase the Seebeck coefficient for higher power factor. In conclusion, the key goal of the research programme of the IRTG was to perform high-quality research to make substantial contributions for solving the challenges of future integrated circuit development and fabrication in selected fields with focus on interconnect systems and nanosystems.

Projektbezogene Publikationen (Auswahl)

• Investigation of the Dielectric Function of Guanine and Cytosine Heterostructures; BESSY Jahresbericht 2006, pp 616-618 (2007). ISSN: 0179-4159
  Louis, S.J.; Rudra, S.; Friedrich, M.; Zahn, D.R.T.; Silaghi, S.D.; Cobet, C.; Esser, N.; Braun, W.
  
• 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology; Smart Systems Integration 2007. Paris (France), 27-28 March 2007, Proceedings, VDE VERLAG GMBH, Berlin und Offenbach, pp 649-651 (2007). ISBN: 978-3- 8007-3009-4
  Wieland, R.; Ecke, R.; Klumpp, A.; Merket, R.; Schulz, S.E.; Ramm, P.
  
• Atomic Layer Deposition of Copper and Copper Oxide for Applications in Microelectronic Metallization Systems, NanoScience 2007 - 5th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 18-20 October 2007, Micromaterials and Nanomaterials 07/2007, pp 26-27 (2007), ISSN: 1619-2486
  Waechtler, T.; Schulz, S.E.; Oswald, S.; Gessner, T.
  
• CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices; in: ICPT - International Conference on Planarization/CMP, ed. by Zwicker, Gerfried, pp 297-302 (2007), ISBN: 9783800730650
  Gottfried, K.; Schubert, I.; Schulze, K.; Schulz, S.E.; Gessner, T.
  
• Composite films of copper and copper oxide deposited by ALD; Poster AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, CA (USA), 24-27 June 2007
  Waechtler, T.; Roth, N.; Oswald, S.; Schulz, S.E.; Lang, H.; Gessner, T.
  
• Concept for determination of intrinsic stresses by nanoindentation; Poster, 8th European Symposium on Nano-Mechanical Testing, Hückelhoven (Germany), 3-5 September 2007
  Chukhrai, O.; Schwarzer, N.; Richter, P.
  
• Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers; Poster, Advanced Metallization Conference 2007 (AMC 2007), Albany, NY (USA), 9-11 October 2007, MRS Conf. Proc. AMC XXlll, pp 23-29 (2008). ISBN: 978-1-55899-992-3, ISSN 1048-0854
  Waechtler, T.; Oswald, S.; Pohlers, A.; Sehulze, S.; Sehulz, S.E.; Gessner, T.
  
• Copper thin films grown via ALD of copper oxide; Talk, European Congress on Advanced Materials and Processes - EUROMAT; Nürnberg (Germany). 10-13 September 2007
  Waechtler, T.; Jakob, A.; Roth, N.; Oswald, S.; Schulz, S.E.; Lang, H.; Gessner, T.
  
• Deposition and properties of porous ultra-low-k dielectric films; Talk, 8th Seminar Porous Glasses - Special Glasses, Wroclaw (Poland), 4-8 September 2007
  Schulz, S.E.; Ahner, N.
  
• Determination of intrinsic stresses in thin films by nanoindentation; Poster, 2nd International Conference NANOSIZED SYSTEM: structure-properties-technology, Kiev (Ukraine), 21-23 November 2007
  Chukhrai, O.; Schwarzer, N.; Richter, F.
  
• Determination of intrinsic stresses in thin films by nanoindentation; Poster, DPG Frühjahrstagung, Regensburg (Germany), 26-30 March 2007
  Chukhrai, O.; Schwarzer, N.; Richter, P.
  
• Feedforward correction and non-linearities in piezoelectric scanner constructions and their experimental verification; Rev. Sci. Instrum. 78, pp 053706 (2007)
  Graffel, B.; Müller, F.; Müller, A.-D.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1063/1.2736786)
• Influence of barrier crystallization on CV characteristics of MIS structures; Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 17-19 October 2006; MRS Conf. Proc. AMC XXII, pp 123-128 (2007). ISBN: 1-55899-865-9, ISSN: 1048-0854
  Ecke, R.; Rennau, M.; Zimmermann, S.; Schulz, S.E.; Gessner, T.
  
• Novel Copper(l) and Silver(l) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver; Smart Systems Integration 2007, Paris (France), 27-28 March 2007; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach, pp 531-533 (2007), ISBN: 978-3-8007-3009-4
  Fruehauf, S.; Gessner, T.; Haase, T.; Jakob, A.; Kohse-Hoeinghaus, K.; Lang, H.; Schulz, S.E.; Waechtler, T.
  
• Phosphane copper(l) complexes as CVD precursors; Surf. Coat. Technol. 201, pp 9089-9094 (2007)
  Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1016/j.surfcoat.2007.05.004)
• Phosphane copper(l) complexes as CVD precursors; Surf. Coat. Teehnol. 201, pp 9089-9094 (2007)
  Roth, N.; Jakob, A.; Wächtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1016/j.surfcoat.2007.05.004)
• Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics; Microelectron. Eng. 84, pp 2606- 2609 (2007)
  Ahner, N.; Schulz, S.E.; Blaschta, P.; Rennau, M.
  (Siehe online unter https://doi.org/10.1016/j.mee.2007.06.007)
• Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behavior, reliability; Advanced Metallization Conference 2008 (AMC 2008), San Diego, CA (USA). 23-25 September 2008, MRS Conf. Proc. AMC XXIV, pp41-52 (2009), ISSN: 978-1-60511-125-4
  Schulze, K.; Schulz, S.E.; Koerner, H.; Gessner, T.
  
• ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices; Talk; 8th International Conference on Atomic Layer Deposition (ALD 2008), Bruges (Belgium), 29 June-2 July 2008
  Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Schulz, S.E.; Gessner, T.
  
• Analysis of damascene-fabricated Cu lines by electron backscatter diffraction and X-ray diffraction; Poster, AKF Frühjahrstagung Berlin 2008, Berlin (Germany), 2008. Abstract ISSN 0420-0195
  Moskvinova, A.; Schulze, S.; Hietschold, M.; Ecke, R.; Schubert, I.; Schulz, S.E.
  
• Atomic layer deposition of copper and copper oxide thin films for applieafions in microelectronic metallization systems; Invited Talk, GerALD 2008 - German Workshop on Atomic Layer Deposition. Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 22-23 September 2008
  Waechtler, T.; Roth, N.; Oswald. S.; Lang, H.; Schulz, S.E.; Gessner, T.
  
• Atomic Layer Deposition of Ultra-Thin Copper and Copper Oxide Films for ULSI Metallization Purposes; Poster, Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 23-25 September 2008
  Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• Chapter Metallization by CVD of W and Cu, in: Handbook of 3D Integration - Technology and Applications of 3D Integrated Circuits, Volume I, ed. by Garrou, P.; Bower, C.; Ramm, P. (2008), ISBN: 978-3-527-32034-9
  Klumpp, A.; Wieland, R.; Ecke, R.; Schulz, S.E.
  
• Chemical Properties of the Inon-CuPe Interface; BESSY Jahresbericht 2007, pp 493-495 (2008), ISSN: 0179-4159
  Ivaneo, J.; Toader, T.; Zahn, D.R.T.; Braun, W.
  
• Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications; Microelectron. Eng. 85; pp 1979-1983 (2008)
  Hermann, S.; Ecke, R.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://dx.doi.org/10.1016/j.mee.2008.06.019)
• Copper Oxide and Copper Thin Films Grown by ALD for Seed Layer Applications; Talk, Twenty Fifth International VLSI Multilevel Interconnection Conference (VMIC), Fremont, CA (USA), 28-30 October 2008, Proceedings, pp 365
  Waechtler, T.; Schulz, S.E.
  
• Copper(l) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1 , 2 , 3 ) - Synthesis, Properties, and their Use as CVD Precursors; Z. Anorg. Allg. Chem. 634, pp 2226-2234 (2008)
  Jakob, A.; Shen, Y.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Riedel, R.; Fasel, C.; Lang, H.
  (Siehe online unter https://doi.org/10.1002/zaac.200800189)
• Determination of intrinsic stresses in thin films by nanoindentation; Poster, Materials for Advanced Metallization (MAM), Dresden (Germany), 2-5 March 2008
  Chukhrai, O.; Clausner, A.; Schwarzer, N.; Richter, P.
  
• Determination of intrinsic stresses in thin films by nanoindentation; Talk, AKF Frühjahrstagung Berlin 2008, Berlin (Germany), 25-29 February 2008
  Chukhrai, O.; Clausner, A.; Schwarzer, N.; Richter, P.
  
• Determination of yield strength by normal/lateral mixed load nanoindentation experiments; Talk, 9th European Symposium on nanomechanical Testing. Hückelhoven (Germany). 9-11 September 2008
  Chukhrai, O.
  
• Growth of Multi-Walled Carbon Nanotubes on different Support/Catalyst Systems for Interconnect Applications; Poster, Ninth International Conference on the Science and Application of Nanotubes - NT08, Montpellier (France), 29 June-4 July 2008
  Hermann, S.; Schulz, S.E.; Gessner, T.
  
• Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition; Talk, Advanced Metallization Conference 2007 (AMC 2007), Albany, NY (USA), 9-11 October 2007, MRS Conf. Proc. AMCXXIV, pp 623-630 (2008), ISBN: 978-1-55899-992-3, ISSN: 1048-0854
  Hofmann, L.; Kuechler, M.; Gumprecht, T.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• New precursors for CVD copper metallization; Microeleetron. Eng. 85, pp 2159-2163 (2008)
  Norman, J.A.T.; Perez, M.; Schulz, S.E.; Waechtler, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2008.05.036)
• Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range; Microelectron. Eng. 85. pp 2111-2113 (2008)
  Ahner, N.; Schulz, S.E.; Blaschta, F.; Rennau, M.
  (Siehe online unter https://doi.org/10.1016/j.mee.2008.05.029)
• Research into device properties and stress fields at lateral nanoindentation experiments; Talk, 9th European Symposium on Nano-Mechanical Testing, Hückelhoven (Germany), 9-11 September 2008
  Clausner, A.; Richter, F.; Herrmann, M.; Chudoba, T.
  
• Silver, Copper and Ruthenium Precursors for ALD and CVD - An Overview; Poster, GerALD 2008 ~ German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 22-23 September 2008
  Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
  
• Some research into the practical and theoretical treatment of lateral load in nanoindentation; Poster, Materials for Advanced Metallization Conference (MAM), Dresden (Germany), 2-5 March 2008
  Clausner A.; Chukhrai, O.; Richter, P.; Schwarzer, N.
  
• Spectroscopic Ellipsometry Study of Thin Diffusion Barriers of TaN and Ta for Cu Interconnects in Integrated Circuits; BESSY Jahresbericht 2007, pp 131-133 (2008), ISSN: 0179-4159
  Rudra, S.; Himcinschi, C.; Wächtler, T.; Friedrich, M.; Louis, S.J.; Cobet, C.; Esser, N.; Geßner, T.; Zahn, D.R.T.
  
• Spectroscopie ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits; Phys. Stat. Sol. A 205, pp 922-926 (2008)
  Rudra, S.; Waechtler, T.; Friedrieh, M.; Louis, S.J.; Himcinschi, C.; Zimmermann, S.; Schulz, S.E.; Silaghi, S.; Cobet, C.; Esser, N.; Gessner, T.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1002/pssa.200777831)
• STM and STS on Ultrathin Organic Layers of Fluorinated Cobalt Phthalocyanine (F16CoPe) on Crystalline Substrates; Talk; AKF Frühjahrstagung Berlin 2008. Berlin (Germany), 2008. Abstract ISSN 0420-0195
  Abdel-Hafiez, M.; Toader, M.; Gopakumar, T.; Hietschold, M.
  
• Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions; 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Bruges (Belgium), 21-24 September 2008; Proceedings, pp 119-120 (2008)
  Ahner, N.; Schaller, M.; Bartsch, C.; Baryschpolec, E.; Schulz, S.E.
  
• Vacuum Ultraviolet Ellipsometry Investigation of Ultrathin Organic Films and Their Heterostructures; Appl. Surf. Sci. 255, pp 694-697 (2008)
  Sindu, J.; Rudra, S.; Lehmann, D.; Friedrich, M.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1016/j.apsusc.2008.07.055)
• Adsorption Geometry and Molecular Orbital Structure of Fluorinated Cobalt Phthalocyanine (FieCoPc) Layers on HOPG Substrate; AKF Frühjahrstagung Dresden 2009, Abstract, ISSN: 0420-0195
  Abdel-Hafiez, M.; Toader, M.; Gopakumar, T.G.; Abbasi, A.; Hietschold, M.
  
• Adsorption induce charge transfer effect at the F16CoPc / Ag(110) interface, revealed by STM / STS; Poster, 15. Tagung Festkörperanalytik, Chemnitz (Germany), 12 - 16 July 2009
  Toader, M.; Gopakamur, T.G.; Abdel-Hafiez, M.; Hietschold, M.
  
• Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS; Poster, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 9-11 March 2009
  Zimmermann, S.; Ahner, N.; Blaschta, P.; Schaller, M.; Ruelke, H.; Schulz, S.E.; Gessner, T.
  
• Carbon Nanotubes for low temperature flip chip connections; Poster, Tenth International Conference on the Science and Application of Nanotubes - NT09, Beijing (China), 21-26 June 2009
  Hermann, S.
  
• Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals; Poster, IEEE International Interconnect Technology Conference (IITC), Sapporo (Japan), June 2009
  Oszinda, T.; Schaller, M.; Fischer, D.; Leppack, S.; Schulz, S.E.
  
• Controlling Geometric and Electronic Properties of Highly-Ordered CuPc Thin Films, Appl. Surf. Sci. 255, pp 6806-6808 (2009)
  Toader, T.; Gavrila, G.; Ivaneo, J.; Braun, W.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1016/j.apsusc.2009.02.078)
• Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials; Talk, Advanced Metallization Conference 2009 (AMC 2009), Baltimore, MD (USA), 13-15 October 2009. MRS Proceeding of the AMC 2009, ISSN: 1048-0854
  Waechtler, T.; Schulz, S.E.; Hofmann, L.
  
• Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials; Talk, Advanced Metallization Conference 2009, 19th Asian Session (ADMETA 2009), Tokyo (Japan), 19-21 October 2009
  Schulz, S.E.; Waechtler, T.; Hofmann, L.
  
• Copper Oxide ALD from a Cu(l) beta-Diketonate: Growth Studies and Application as Seed Layers for Electrochemical Copper Deposition; Talk, 216th ECS Meeting, Vienna (Austria), 4-9 October 2009
  Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
  
• Copper Oxide ALD from a Cu{l) beta-Diketonate: Detailed Growth Studies on SiOz and TaN; ECS Trans. 25, pp 277-287 (2009)
  Waechtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1149/1.3205062)
• Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-nbutylphosphane)copper(l)acetylaeetonate on Ta, TaN, Ru, and SiO2; J. Electrochem. Soc. 156, pp H453-H459 (2009)
  Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1149/1.3110842)
• Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging; 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Delft (The Nederlands), 27-29 April 2009, Proceedings, pp 348-354, ISBN: 978-1- 4244-4159-4
  Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
  
• Detailed Study of Copper Oxide ALD on SiO2, TaN and Ru; Talk, AVS 9th International Conference on Atomic Layer Deposition (ALD 2009), Monterey, CA (USA), 19-22 July 2009
  Waechtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
  
• Electrical resistivity calculations for copper nanointerconnect: Poster. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 8-11 March 2009
  Zong, Zh.; Mohammadzadeh, S.; Cao, Y.; Qiu, Zh.; Liu, R.; Streiter, R.; Gessner, T.
  
• Electrical resistivity calculations for copper nanointerconnect; Microelectron. Eng. 87, DD 402-405 (2009)
  Zong, Zh.; Mohammadzadeh, S.; Cao, Y.; Qiu; Zh.; Liu; R.; Streiter, R.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/i.mee.2009.07.012)
• Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration; Talk, Advanced Metallization Conference 2009 (AMC 2009), Baltimore, MD (USA), 13-15 October 2009, MRS Proceeding of the AMC 2009, pp 241-252, ISBN: 978-1-605-11218-3
  Hofmann, L.; Braeuer, J.; Baum, M.; Schulz, S.E.; Gessner, T.
  
• Electronic transport properties of copper atomic wires; Poster, Advanced Metallization Conference 2009 (AMC 2009), Baltimore MD (USA), 13-15 October 2009, MRS Proceeding of the AMC 2009, pp 127-131, ISBN: 978-1-605-11218-3
  Mohammadzadeh, S.; Streiter, R,; Gessner, T.
  
• Facile Fabrication of Ultrafine Copper Nanoparticles in Organic Solvent; Nanoscale Res. Lett. 4, pp 705-708 (2009)
  Zhang, H.-X.; Siegert, U.; Liu, R.; Cai, W.-B.
  (Siehe online unter https://doi.org/10.1007/s11671-009-9301-2)
• Geometry dependent l-V characteristics of gold atomic-sized contacts; Talk, 9th Nanotechnology Conference, Genoa (Italy), 26-30 July 2009, Proceedings, pp 884-886, ISSN: 1944-9399
  Mohammadzadeh, S.; Streiter, R.; Gessner, T.
  
• Growth of carbon nanotubes on different support/catalyst systems for interconnect and sensor applications; Talk, China International Micro-Nano Expo (CIMNE), Shanghai (China), 1-3 April 2009
  Hermann, S.; Ecke, R.; Pähl, B.; Schulz, S.E.
  
• Growth of carbon nanotubes on different support/catalyst systems for interconnect and sensor applications; Talk, DPG Frühjahrstagung, Dresden (Germany), 22-27 March 2009
  Hermann, S.; Ecke, R.; Pähl, B.; Schulz, S.E.
  
• Herstellung und Evaluierung nanoskaliger reaktiver Strukturen für den Einsatz von Niedertemperatur-Bondverfahren in der Mikrosystemtechnik; Poster, MST-Kongress 2009, Berlin (Deutschland), 12-14 Oktober 2009; Proceedings, ISBN: 978-3-8007-3183-1
  Bräuer J.; Hofmann L.; Werner T.; Wiemer, M.; Geßner T.
  
• Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low-k SiOCH dielectric using chemometric methods; J. Vac. Sci. Technol. B 27, pp 521-526 (2009)
  Oszinda, T.; Beyer, V.; Schaller, M.; Fischer, D.; Bartsch, C.; Schulz, S.E.
  (Siehe online unter https://doi.org/10.1116/1.3043466)
• Improvement of Etch Processes for SiCOH Materials with Novel in situ Diagnostic and Evaluation Methods; Talk. Advanced Metallization Conference 2009 (AMC 2009), Baltimore, MD (USA), 13-15 October 2009, MRS Proceeding of the AMC 2009, pp 101-100, ISBN: 978-1-605-11218-3
  Zimmermann, S.; Ahner, N.; Blaschta, P.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpeke, J.; Schulz, S.E.; Gessner, T.
  
• In Situ Investigation of Phthalocyanine Thin Films Grown on H-Si{111); Poster, 5th Workshop of Spectroscopic Ellipsometry, Zweibrücken (Germany), 2-4 March 2009
  Ding, L.; Seidel, P.; Himcinschi, C.; Friedrich, M.; Zahn, D.R.T.
  
• Investigation of physical and chemical properties of ultra low-k SiCOH layers with respect to cleaning and repair processes; Talk, Materials forAdvanced Metallization Conference (MAM), Grenoble (France), 8-11 March 2009
  Oszinda, T.; Schaller, M.; Fischer, D.; Leppack, S.; Schulz, S.E.
  
• Low temperature aligned deposition of carbon nanotubes for nanoscale interconnects and NEMS applications; Poster, DPG Frühjahrstagung, Dresden (Germany). 22-27 March 2009
  Hermann, S.; Loschek, S.; Bonitz, J.; Ping, L.; Schulz, S.E.
  
• Magnetization Reversal in Arrays of Magnetic Nano perforations; IEEE Trans. Magn. 45, pp 3515-3518 (2009)
  Makarov, D.; Krone, P.; Lantiat, D.; Schulze, C ; Liebig, A.; Brombaeher, C.; Hietschold, M.; Hermann, S.; Laberty, C ; Grosso, D.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1109/TMAG.2009.2025181)
• Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik; Talk, 12. Werkstofftechnisches Kolloquium und 8. Industriefachtagung Oberflächen- und Wärmebehandlungstechnik 2009, Chemnitz (Germany), 1-2 Oktober 2009, Tagungsband zum 12. Werkstofftechnisches Kolloquium WTK, pp 120-125. ISBN: 978-3-00-029007-7
  Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• Micro Devices for RF Applications; Talk, ISMOT 2009, New Delhi (India), 16-19 December 2009, Proceedings
  Gessner, T.; Leidich, S.; Nowack, M.; Froemel, J.; Hofmann, L.; Kurth, S.; Bertz, A.
  
• Modular aufgebaute „process-unit" - neues Anlagenkonzept für nasschemische Ätzprozesse und die Wafergalvanoformung, Galvanotechnik; Talk, ZVO-Oberflächentage, Bremen (Germany), September 2009, Proceedings
  Guttmann, M.; Kaiser, K.; Muth, S.; Moritz, H.M.; Schmidt, R.; Zwanzig, M.; Hofmann, L.; Schubert, I.
  
• Nanofabrlcation of Reactive Structure for Low Temperature Bonding; Talk, IEEE Nanomed Conference, 18-21 October 2009, Proceedings, pp 313-317
  Lin, Y.-C; Bräuer, J.; Hofmann, L.; Baum, M.; Froemel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/NANOMED.2009.5559063)
• Optical investigation of CuPc thin films on vicinal Si(111); Poster, 12th International Conference on the Formation of Semiconductor Interfaces. Weimar (Germany), 05-12 July 2009
  Ding, L.; Himcinschi, C.; Friedrich, M.; Zahn, D.R.T.
  
• Optical Properties and Morphology of CuPc Films on Vicinal Si(111); Talk, DPG Frühjahrstagung, Dresden (Germany). 22-27 March 2009
  Ding, L.; Seidel, P.; Pop, S.; Himcinschi, C.; Friedrich, M.; Zahn, D.R.T.
  
• Process Development for Smart Systems Integration in MEMS; MST News 03/09, pp 35-36 (2009); ISSN: 0948-3128
  Ecke, R.; Froemel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T.
  
• Quantifying and enforcing two-dimensional symmetries in scanning probe microscopy images; Frontiers of Characterization and Metrology for Nanoelectronics: 2009. AIP Conference Proceedings 1173, pp 294-298 (2009)
  Moeck, P.; Toader, M.; Abdel-Hafiez, M.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1063/1.3251237)
• Research into the parallel determination of Young's modulus E and Poisson's ration via normal and lateral nanoindentation experiments; Talk, DPG Frühjahrstagung, Dresden (Germany), 22-27 March 2009
  Clausner, A.; Richter, P.
  
• Restoration of Plasma Damaged Porous Ultra Low-k SiOCH Films: A Coating Process with UV Activation Versus a Vapor Phase Process with Thermal Activation; Talk, Advanced Metallization Conference 2009 (AMC 2009), Baltimore (USA), 13-15 October 2009, MRS Proceeding of the AMC 2009, pp 55-64, ISBN: 978-1-605-11218-3
  Oszinda, T.; Schaller, M.; Schulz, S.E.
  
• Selective deposition of aligned carbon nanotubes for NEMS aDDlicatlons, GMM-WorkshoD Mikro-Nano-lntegration, Seeheim (Germany), 12-13 March 2009; Proceedings, ISBN: 978-3-8007-3155-8
  Bonitz, J.; Hermann, S.; Loschek, S.; Liu, P.; Schulz, S.E.
  
• Solid-Liquid-lnterdiffusion Bonding für 3D-lntegration und Wafer-Level-Paekaging; Talk, MST-Kongress 2009, Berlin (Deutschland), 12-14 October 2009; Proceedings, ISBN: 978-3- 8007-3183-1
  Baum, M.; Hofmann, L.; Wiemer, M.; Geßner, T.
  
• STM and STS study of F16CoPe adsorbed onto Ag(IIO) surface; Talk, DPG Frühjahrstagung, Dresden (Germany), 22-27 March 2009
  Toader, M.; Gopakamur, T.G.; Abdel-Hafiez, M.; Hietschold. M.
  
• STM and STS study of the F16CoPc / Ag{110) interface; Talk, 15. Tagung Festkörperanalytik, Chemnitz (Germany), 12-16 July 2009
  Toader, M.; Gopakamur, T.G.; Abdel-Hafiez, M.; Hietschold, M.
  
• Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions; Sol. St. Phen. 145-146. pp 319-322 (2009)
  Ahner, N.; Schaller, M,; Bartsch, C ; Baryschpolec, E.; Schulz, S.E.
  (Siehe online unter https://doi.org/10.4028/www.scientific.net/SSP.145-146.319)
• Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric Material; 216th ECS Meeting, Vienna (Austria). 4-9 October 2009; ECS Trans. 25, pp 87-94 (2009)
  Ahner, N.; Schulz, S.E.; Zacher, M.
  (Siehe online unter https://doi.org/10.1149/1.3202639)
• Templateguided self-assembly mechanism at F16CoPc / Ag{110) interface, revealed by STM; Poster, 15. Tagung Festkörperanalytik, Chemnitz (Germany), 12-16 July 2009
  Toader, M.; Gopakamur, T.G.; Abdel-Hafiez, M.; Hietschold, M.
  
• Theoretical study of geometry dependent l-V characteristics of copper and gold quantum point contacts; Talk, DPG Frühjahrstagung, Dresden (Germany), 22-27 March 2009
  Mohammadzadeh, S.; Streiter, R.; Gessner, T.
  
• UV assisted curing of plasma damaged porous ultralow-k material after a k-restore process: influence of UV-wavelength and curing ambient; Advanced Metallization Conference AMC (AMC 2008), San Diego, CA (USA), 23-25 September 2008, MRS Conf. Proc. AMC XXIV, pp 599-604 (2009), ISBN: 978-1-60511-125-4
  Ahner, N.; Schulz, S.E,; Prager, L.; Schaller, M.
  
• UV assisted curing of plasma damaged porous ultralow-k materials for a krecovery process: influence of curing-cycle modifications; Poster, Advanced Metallization Conference 2009 (AMC 2009), Baltimore, MD (USA), 13-15 October 2009
  Ahner, N.; Fischer, T.; Zimmermann, S,; Schaller, M.; Prager, L.; Schulz, S.E.
  
• Valence Band Fine Structure of Copper Phthalocyanine Thin Films: Effect of Molecular 161 Orientation, Phys. Stat. Sol. B 246, pp 1510-1518 (2009)
  Toader, T.; Gavrila, G.; Braun, W.; Ivaneo, J.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1002/pssb.200945141)
• Vibrational Properties of Perfluoropentacene Thin Film, J. Electron Spectrosc. 174. pp 65- 69 (2009)
  Fujii, K.; Himcinschi, C.; Toader, M.; Kera, S.; Zahn, D.R.T.
  (Siehe online unter https://dx.doi.org/10.1016/j.elspec.2009.01.002)
• A combined Etch, Cleaning and k-restore Process for less damage integration of ultra low-k materials; Talk, SEMICON 2010, Dresden (Germany), 19-21 October 2010
  Zimmermann, S.; Ahner, N.; Fischer, T.; Schulz, S.E.; Gessner, T.
  
• Adsorption of cobalt phthalocyanine on rutile TiO2 (110) surfaces: interface formation; Talk, DPG Frühjahrstagung, Regensburg (Germany), 21-26 March 2010
  Shukrynau, P.; Toader, M.; Hietschold, M.
  
• ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems: Talk, Materials for Advanced Metallization (MAM). Mechelen (Belgium), 7-10 March 2010
  Waechtler, T.; Ding, S.-F.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T.
  
• Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS; Microelectron. Eng. 87, pp 337-342 (2010)
  Zimmermann, S.; Ahner, N.; Blaschta, P.; Schaller, M.; Ruelke, H.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2009.08.004)
• Approaches for Fabrication of Carbon Nanotube Vias; Poster, Nanoelectronic Days 2010, Aachen (Germany), 4-7 October 2010
  Hermann, S.; Fiedler, H.; Waechtler, T.; Falke, M.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• Carbon Nanotubes for Nanoscale Low Temperature Flip Chip Connections; Microelectron. Eng. 87, pp 438-442 (2010)
  Hermann, S.; Pähl, B.; Ecke, R.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2009.05.027)
• Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film using a Vapor Phase Process; ECS Trans. 25, pp 19-30 (2010)
  Oszinda, T.; Schaller, M.; Schulz, S.E.
  (Siehe online unter https://doi.org/10.1149/1.3390654)
• Coated Multiwall-Carbon-Nanotubes: EELS in Cs-corrected STEM and Liquid Nitrogen free EDS; Poster, 17th International Microscopy Congress (IMC17), Rio de Janeiro (Brasil), 19-24 September 2010
  Falke, M.; Terborg, R.; Käppel, A.; Rohde, M.; Gass, M.; Andrew, B.; Hermann, S.
  
• Control of molecular selfassembly at the liquid-solid interface (LSI) studied by scanning tunneling microscopy (STM); Talk, 27th European Conference on Surface Sciences (ECOSS 27), Groningen (The Netherlands), 28 August - 3 September 2010
  Ha, N.T.N.; Gopakumar, T.G.; Hietschold, M.
  
• Control of self-assembled pattern at the solid-liquid interface: Trimesic Acid (TMA) on HOPG(OOOI); Poster, International Conference on Molecular Materials (MOLMAT), Montpellier (Prance), 5-8 July 2010
  Hietschold, M.; Ha, N.T.N.; Gopakumar, T.G.
  
• Disilver(l) Coordination Complexes: Synthesis, Reaction Chemistry, and Their Potential Use in CVD and Spin-Coating Processes for Silver Deposition; Eur. J. Inorg. Chem. 2010, pp 2975-2986 (2010)
  Jakob, A.; Rueffer, T.; Schmidt, H.; Djiele, P.; Koerbitz. K.; Ecorchard, P.; Haase, T.; Kohse-Hoeinghaus, K.; Fruehauf, S.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1002/ejic.201000159)
• Electronic Transport in Carbon Nanotubes with Copper Contacts; Poster, Psi-k Conference, Berlin (Germany), 12-16 September 2010
  Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
  
• Electronic Transport Properties of Copper and Gold at Atomic Scale; Technische Universität Chemnitz, 2010
  Mohammadzadeh, S.
  
• Electronic Transport through Carbon Nanotubes with Metal Contacts; Poster, IWEPNM, Kirchberg (Austria), 6-13 March 2010
  Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
  
• Etch processes for dense and porous SiCOH materials: plasma states and process results; Poster, 3rd International Workshop Plasma Etch and Strip in Microelectronics (PESM 2010), Grenoble (France), 4-5 March 2010
  Zimmermann, S.; Ahner, N.; Blaschta, P.; Schaller, M.; Zimmermann, H.; Ruelke, H.; Lang, N.; Roepeke, J.; Schulz, S.E.; Gessner, T.
  
• Exploring the CoPc@HOPG interface: STM and STS study; Poster, DPG Frühjahrstagung, Regensburg (Germany), 21-26 March 2010
  Smykalla, L.; Toader, M.; Shukrynau, P.; Hietschold, M.
  
• Exploring the F16CoPc/Ag(110) Interface Using Scanning Tunneling Microscopy and Spectroscopy. Part 1: Template-Guided Adlayer Structure Formation; J. Phys. Chem. C 114, pp 3537-3543 (2010)
  Toader, M.; Gopakumar, T.G.; Abdel-Hafiez. M.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1021/jp9078019)
• Exploring the F16CoPc/Ag(110) Interface Using Scanning Tunneling Microscopy and Spectroscopy. Part 2: Adsorption-Induced Charge Transfer Effect; J. Phys. Chem. C 114, pp 21548-21554 (2010)
  Toader, M.; Gopakumar, T.G.; Shukrynau, P.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1021/jp1078295)
• Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE); Talk, 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromeehanik & Mikroelektronik, Chemnitz (Germany). 20-21 October 2010
  Kuechler, M.; Hofmann, L.; Hahn, R.; Bertz, A.; Gessner, T.
  
• Gold Nanoparticles Generated by Thermolysis of Gold(l) Carboxylates; Poster, 3rd EuCheMS Chemistry Congress, Nuremberg (Germany), 29 August - 2 September 2010
  Tuchscherer, A.; Lang, H.
  
• How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure; ECS Trans. 28, pp 355-360 (2010)
  Oszinda, T.; Schaller, M.; Dittmar, K.; Jinag, Le; Schulz, S.E.
  (Siehe online unter https://doi.org/10.1149/1.3372590)
• How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure; Talk, Electrochemical Society Meeting (217th ECS), Vancouver (Canada), 25-30 April 2010
  Oszinda, T.; Schaller, M.; Dittmar, K.; Jinag, Le; Schulz, S.E.
  
• How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure; Talk, Materials for Advanced Metalization Conference (MAM), Mechelen (Belgium), 07-10 March 2010
  Oszinda, T.; Schaller, M.; Dittmar, K.; Jinag, Le; Schulz, S.E.
  
• In situ investigation of CuPc thin films grown on vicinal Si(111); Talk, 37th Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-37), Santa Fe, NM (USA), 10-14 January 2010
  Ding, L.; Friedrich, M.; Gordan, O.; Zahn, D.R.T.
  
• In situ investigation of CuPc thin films grown on vicinal Si(111); Talk, DPG Frühjahrstagung, Regensburg (Germany), 21-26 March 2010
  Ding, L.; Friedrich, M.; Gordan. O.; Zahn, D.R.T.
  
• In situ investigation of CuPc thin films grown on vicinal Si{111); J. Vac. Sci. Technol. B 28, pp C5F17 (2010)
  Ding, L.; Friedrich, M.; Gordan, O.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1116/1.3442797)
• In situ investigation of CuPc thin films grown on vicinal Si{111); Poster, 3rd NanoCharm School on Ellipsometry, Salzburg (Austria), 27 February - 5 March 2010
  Ding. L.; Friedrieh, M.; Gordan, O.; Zahn, D.R.T.
  
• In-situ growth and electronic structure monitoring at the F16CoPe/Ag(111) interface; Poster, IVth International Conference on Molecular Materials, Montpellier (France), 5-8 July 2010
  Toader, M.; Shukrynau, P.; Hietschold, M.
  
• Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials; Talk, Advanced Metallization Conference 2010 (AMC 2010), Albany, NY (USA), 5-7 October 2010
  Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
  
• Inhibition of enhanced Cu oxidation on ruthenium; Poster, 2010 International Interconnect Technology Conference (IITC). Burlingame, CA (USA), 6-9 June 2010. Proceedings
  Ding, S.-F.; Waechtler, T.; Xie, Q.; Lu, H.-S.; Schulz, S.E.; Qu, X.-P.
  (Siehe online unter https://doi.org/10.1109/IITC.2010.5510315)
• Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen; Talk, 10. Chemnitzer Fachtagung Mikromeehanik & Mikroelektronik, Chemnitz (Germany), 20-21 October 2010
  Hermann, S.; Loschek, S.; Haibo, Y.; Bonitz, J.; Schulz, S.E.; Gessner, T.
  
• Investigation of Formic Acid Reduction of Ruthenium-Containing Copper Oxide Layers Prepared by ALD; Talk, Baltic ALD 2010 & GerALD 2, Hamburg (Germany), 16-17 September 2010
  Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Schulz, S.E.; Gessner, T.; Lang, H.
  
• Investigation of physical and chemical property changes of ultra low-k SioCH in aspect of cleaning and chemical repair processes; Microelectron. Eng. 87, pp 457-461 (2010)
  Oszinda, T.; Schaller, M.; Fischer, D.; Walsh. C ; Schulz, S.E.
  (Siehe online unter https://doi.org/10.1016/j.mee.2009.06.028)
• Investigation of the solution behavior of tri-nbutylphosphine copper{l) and silver{l) acetates using 3ip{iH} NMR spectroscopy; Inorg. Chim. Acta 363, pp 944-948 (2010)
  Siegert, U.; Hahn, H.; Lang. H.
  (Siehe online unter https://doi.org/10.1016/j.ica.2009.12.027)
• Investigations of nanoindentation data obtained by the combination of normal and mixed (normal and lateral) forces; Technische Universität Chemnitz, 2010
  Chukhrai, O.
  
• Investigations Regarding Through Silicon Via Filling for 3D Integration by Periodic Pulse Reverse Plating with and without Additives; Poster, Materials for Advanced Metallization - MAM, Mechelen (Belgium), 8-10 March 2010
  Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• Local-Illuminated Ultrathin Silicon Nanomembranes with Photovoltaic Effect and Negative Transconductance; Adv. Mater. 22, pp 3667- 3671 (2010)
  Feng, P.; Moench, I.; Huang, G.S.; Harazim, S.; Smith, E.J.; Mei, Y.F.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201000583)
• Metal and Metal Oxid Nanoparticles; Poster, 6. Thüringer Grenz- und Oberflächentage (ThGOT) 2010, Gera (Germany), 7-9 September 2010
  Jakob, A.; Tuchscherer, A.; Dietrich, S.; Mothes, R.; Lang, H.
  
• Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik; Galvanotechnik 101, pp 1880-1884 (2010)
  Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• New Materials and Chemistry: Small Molecules - Great Progress; Poster, Global Challenges for Sustainable Development (GCSD'2010), Sustainable Chemistry and Related Areas, Rennes (France), 25-26 February 2010
  Mothes, R.; Lang, H.
  
• Optical investigation of CuPc thin films on vicinal Si(111); Phys. Stat. Sol. C 7, pp 312-315 (2010)
  Ding, L.; Himcinschi, C.; Friedrich, M.; Zahn, D.R.T
  (Siehe online unter https://doi.org/10.1002/pssc.200982455)
• Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants; Talk, 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), Ostende (Belgium), 20-22 September 2010
  Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
  
• Phosphite Copper(l) Trifluoroacetates [((RO)3P)mCu02CCF3] (m = 1, 2, 3): Synthesis, Solid State Structures and Their Use as CVD Precursors; Dalton Trans. 39, pp 11235-11247 (2010)
  Mothes, R.; Rüffer, T.; Shen, Y.; Jakob, A.; Walfort, B.; Petzold, H.; Schulz, S.E.; Ecke, R.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1039/c0dt00347f)
• Pulse Reverse Electroplating for TSV Filling in 3D Integration; Poster, Smart Systems Integration. Como (Italy), 23-24 April 2010, Proceedings, VDE Verlag GmbH, ISBN: 978-3-8007-3081-0
  Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
  
• Rolled-Up Optical Microcavitles with Subwavelength Wall Thicknesses for Enhanced Liquid Sensing Applications; ACS Nano 4, pp 3132-3130 (2010)
  Huang, G.S.; Quinones, V.A.B.; Ding, P.; Kiravittaya, S.; Mei, Y.F.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1021/nn100456r)
• Self-Assembly Structure of 3D-Molecule Benzene 1,3,5 Triphosphonic Acid (BTP) studied by Scanning Tunneling Microscopy (STM) at the Liquid-Solid Interface; Poster, DPG Frühjahrstagung, Regensburg (Germany), 22-27 March 2010
  Ha, N.T.N.; Dieblich, M.; Mehring, M.; Hietschold, M.
  
• Self-Wound Composite Nanomembranes as Electrode Materials for Lithium Ion Batteries; Adv. Mater. 22, pp 4591-4595 (2010)
  Ji, H.X.; Wu, X.L.; Fan, L.Z.; Krien, C ; Fiering, I.; Guo, Y.G.; Mei, Y.F.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201001422)
• Silber(l)- und Kupfer(l) - Precursoren für CVD, ALD und Spin-Coating Prozesse; Technische Universität Chemnitz, 2010
  Siegert, U.
  
• Simulation of TaNx deposition by Reactive PVD; Microelectron. Eng. 87, pp 1907-1913 (2010)
  Wolf, H.; Streiter, R.; Friedemann, M.; Belsky, P.; Bakaeva, O.; Letz, T.; Gessner, T.
  (Siehe online unter https://dx.doi.org/10.1016/j.mee.2009.11.044)
• STM and STS study at the organicmetal interface: Adsorption of CoPc on Ag(111) surface; Talk, DPG Frühjahrstagung, Regensburg (Germany), 21-26 March 2010
  Toader, M.; Shukrynau, P.; Hietschold, M.
  
• Surface Enhanced Raman Effect of CuPc Employing Silver Nanostructures Prepared by Nanosphere Lithography; Poster, DPG Frühjahrstagung, Regensburg (Germany), 21-26 March 2010
  Ludemann, M.; Gordan, O.D.; Brombacher, C ; Albrecht, M.; Zahn, D.R.T.
  
• Surface Enhanced Raman Effect of CuPc Employing Silver Nanostructures; Poster, Symposium - Confocal Raman Imaging, Ulm (Germany), 5-6 October 2010
  Ludemann, M.; Gordan, O.D.; Zahn, D.R.T.
  
• Surface Enhanced Raman Effect of Ultra-Thin CuPe Films Employing Silver Nanostructures Prepared by Nanosphere Lithography; Talk, X. International Conferece on Nanostructured Materials (NANO2010), Rome (Italy), 13-17 September 2010
  Ludemann, M.; Gordan, O.D.; Zahn, D.R.T.
  
• TEM/EELS analysis of ultra low-k inter-metal dielectric; 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai (China), 1-4 November 2010, Proceedings, pp 1015-1017 (2010)
  Singh, P.; Zimmermann, S.; Schulze, S.; Schulz, S.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1109/ICSICT.2010.5667524)
• Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices; Technische Universität Chemnitz, 2010, Universitätsverlag der Technischen Universität Chemnitz, ISBN: 978-3-941003-17-0
  Wachtler. T.
  
• Transport in carbon nanotubes: Contact models and size effects; Phys. Stat. Sol. B, 247, pp 3002-3005 (2010)
  Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
  (Siehe online unter https://doi.org/10.1002/pssb.201000178)
• A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices; Talk, MRS Spring Meeting 2011, San Francisco, CA (USA), 25-29 April 2011
  Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T.
  
• ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems: Microelectron. Eng. 88, po 684-689 (2011)
  Waechtler, T.; Ding. S.-P.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T.
  (Siehe online unter https://doi.org/10.10l6/i.mee.2010.07.004)
• An Approach for Cu ALD via Reduction of Ruthenium-Containing CuxO Films for the Metallization in Spintronic and ULSI Interconnect Systems; Talk, 11th International Conference on Atomic Layer Deposition (AVS ALD 2011), Cambridge, MA (USA), 26-29 June 2011
  Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.
  
• Copper ALD for Applications in ULSI Metallization Systems and Spintronic Layer Stacks; Poster, IMEC Workshop on Atomic Layer Deposition for Applications in Nanotechnology, Leuven (Belgium), 28-29 November 2011
  Waechtler, T.; Mueller, S.; Mothes, R.; Tuchscherer, A.; Schubert, C.; Lehmann, D.; Haidu, P.; Schaefer, P.; Schulz, S.E.; Lang, H.; Albrecht, M.; Zahn, D.R.T.; Gessner, T.
  
• Copper Films Grown via Copper Oxide ALD Integrated with Different Liner Materials for Interconnect Applications: Talk. 11th International Conference on Atomic Layer Deposition (AVS ALD 2011). Cambridoe, MA (USA), 26-29 June 2011
  Waechtler, T.; Mueller, S.; Hofmann, L.; Mothes, R.; Ding, S.-F.; Schulz, S.E.; Lano, H.; Qu, X.-P.; Gessner, T.
  
• Cu-Si nanocable arrays as high-rate anode materials for lithium-ion batteries; Adv. Mater. 23, pp 4415-4420 (2011)
  Cao, F.-F.; Deng, J.-W.; Xin, S.; Ji, H.-X.; Schmidt, O.G.; Wan. L.-J.; Guo, Y.-G.
  (Siehe online unter https://doi.org/10.1002/adma.201102062)
• Determining the Molecular Orientation of CoPc on in- and out-of-plane Magnetised Substrates by NEXAFS Spectroscopy; Poster, BESSY User Meeting, Berlin (Germany). 1-2 December 2011
  Haidu, P.; Lehmann, D.; Fronk, M.; Mahns, B.; Ludemann, M.; Gordan, O.D.; Schäfer, P.; Knupfer, M.; Braun, W.; Zahn, D.R.T.
  
• Dielectric Function of Ultra-thin High-k Films Grown by Atomic Layer Deposition: Poster, DPG Frühiahrstagunq Dresden (Germany), 13-18 March 2011
  Ding, L.; Chen, L.; Friedrich, M.; Gordan, O.; Zhang, W.; Zahn, D.R.T.
  
• Facile Synthesis of Aq@Pd Satellites - Fe3O4 Core Nanocomposlte as Efficient and Reusable Hydrogenation Catalysts: Chem. Commun. 47, pp 11924-11926 (2011)
  Jiang, K.; Zhang, H.-X.; Yang, Y.-Y.; Mothes, R.; Lang, H.; Cai, W.-B.
  (Siehe online unter https://doi.org/10.1039/C1CC14675K)
• Growth of carbon nanotubes on different support/catalyst systems for advanced interconnects in integrated circuits; Technische Universität Chemnitz, 2011
  Hermann, S.
  
• In Situ Surface Enhanced Raman Spectroscopy of Ultra-Thin CuPc Films; Talk, DPG Frühjahrstagung, Dresden (Germany), 13-18 March 2011
  Ludemann, M.; Gordan, O.D.; Zahn, D.R.T.
  
• Influence of copper on catalytic carbon nanotube growth process; Poster, IEEE International Interconnect Technology Conference (MTC) & Materials for Advanced Metallization (MAM), Dresden (Germany), 9-12 May 2011, IEEE Proceedings
  Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/IITC.2011.5940346)
• Initial growth at the Fi6CoPc/Ag{111) interface; Surf. Sci. 605, pp 1510-1515 (2011)
  Toader, M.; Knupfer, M.; Zahn, D.R.T.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1016/j.susc.2011.05.024)
• Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives; Microelectron. Eng. 88, pp 705-708 {2011)
  Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://dx.doi.org/10.1016/j.mee.2010.06.040)
• Lewisbase Copper(l) Formates: Synthesis, Reaction Chemistry, Structural Characterization and Their Use as Spin-Coating Precursors for Copper Deposition; Inorg. Chim. Acta 365, pp 10-19 (2011)
  Tuchscherer, A.; Shen, Y.; Jakob, A.; Mothes, R.; Al-Anber, M.; Walfort, B.; Rüffer, T.; Frühauf, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1016/i.ica.2010.05.048)
• Low Temperature Cure of BCB and the Influence on the Mechanical Stress; Talk, Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL (USA), 31 May - 3 June 2011. Proceedings, pp 392-400
  Woehrmann, M.; Toepper, M.; Walter, H.; Lang, K.D.
  
• Lutetium(lll) Bis-phthalocyanine on Ag(111) Surface; J. Am. Chem. Soc. 133, pp 5538-5544 (2011)
  Toader, M.; Knupfer, M.; Zahn, D.R.T.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1021/ja200168a)
• Magneto-optical Kerr effect studies of copper oxide and cobalt thin films; Poster. DPG Frühjahrstagung, Dresden (Germany), 13-18 March 2011
  Fronk, M.; Mueller, S.; Waechtler, T.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
  
• Molecular Orientation of CuPc Thin Films Grown on Vicinal H-Si(111) by in situ Investigation; Poster, 6th Workshop of Spectroscopic Ellipsometry, Berlin (Germany), 21-24 February 2011
  Ding, L.; Friedrich, M.; Gordan, O.; Zahn, D.R.T.
  
• New Phosphine Copper(l) and Silver{l) Dithiocarbamates as Suitable Precursors for the Deposition of Copper and Silver Sulfide; Poster, EuroCVD 18, Kinsale, Co. Cork (Ireland). 4-9 September 2011
  Mothes, R.; Lang, H.
  
• Precursor Synthesis and Thermal Studies for Ruthenium and Ruthenium Oxide Deposition; Poster, EuroCVD 18, Kinsale, Co. Cork (Ireland), 4-9 September 2011
  Tuchscherer, A.; Lang, H.
  
• Process Development for the ALD of Thin Copper Films for ULSI Metallization Systems and Magnetosensors; Talk, SENTECH Plasma Process Technology Seminar, 22 November 2011
  Waechtler, T.; Mueller, S.; Schulz, S.E.; Gessner, T.
  
• Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes; Poster, Materials for Advanced Metallization (MAM) & International Interconnect Technology Conference (IITC), Dresden (Germany), 8-12 May 2011, IEEE Proceedings
  Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/IITC.2011.5940363)
• Simple and Efficient: Ethylene Glycol Isonitrile Gold(l) Chlorides for the Formation and Stabilization of Gold Nanoparticles; Eur. J. Inorg. Chem. 28, pp 4421-4428 (2011)
  Tuchscherer, A.; Schaarschmidt, D.; Schulze, S.; Hietschold, M.; Lang, H.
  (Siehe online unter https://doi.org/10.1002/ejic.201100324)
• Simple and Efficient: Gold Nanoparticles from Triphenylphosphane Gold(l) Carboxylates Without Addition of any Further Stabilising and Reducing Reagent; Inorg. Chem. Commun. 14, pp 676-678 (2011)
  Tuchscherer, A.; Schaarschmidt, D.; Schulze, S.; Hietschold, M.; Lang, H.
  (Siehe online unter https://doi.org/10.1016/j.inoche.2011.02.003)
• SnPc on Ag (111): a Scanning Tunneling Microscopy Study at the Sub-molecular Level; J. Phys. Chem. C 115, pp 12494-12500 (2011)
  Toader, M.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1021/jp201933s)
• Stretchable Magnetoelectronics; ACS Nano 11 , pp 2522-2526 (2011)
  Melzer, M.; Makarov, D.; Calvimontes, A.; Karnaushenko, D.; Baunack, S.; Kaltofen, R.; Mei, Y.F.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1021/nl201108b)
• Surfaceenhanced Raman effect in ultra-thin CuPc films employing periodic silver nanostructures; J. Nanoparticle Research 13, pp 5855-5861 (2011)
  Ludemann, M.; Brumboiu, I.E.; Gordan, O.D.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1007/s11051-011-0564-z)
• The incorporation of metal nanostructures at organic/inorganic semiconductor interfaces; Talk, DPG Frühjahrstagung, Dresden (Germany), 13-18 March 2011
  Zahn, D.R.T.; Ludemann, M.; Gordan, O.D.; Schäfer, P.; Salvan, G.
  
• The Inhibition of Enhanced Cu Oxidation on Ruthenium/Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru; J. Electrochem. Soc. 158, pp H1228-H1232 (2011)
  Ding, S.-P.; Xie, Q.; Mueller, S.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Detavernier, C.; Qu, X.-P.; Gessner, T.
  (Siehe online unter https://doi.org/10.1149/2.041112jes)
• Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems: Talk. IEEE 2011 Semiconductor Conference Dresden. Dresden (Germany), 27-28 September 2011, Proceedings
  Mueller, S.; Waechtler, T.; Hofmann, L.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, P.; Ogiewa, M.; Gerlich, L.; Ding, S.-P.; Schulz, S.E,; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P.
  (Siehe online unter https://doi.org/10.1109/SCD.2011.6068736)
• Tuning the Energy Level Alignment at the SnPc/Ag(111) Interface Using an STM Tip; J. Phys. Chem. C 115. pp 3099- 3105 (2011)
  Toader, M.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1021/jp111478v)
• Tuning the Energy Level Alignment at the SnPc/Ag(111) Interface Using an STM Tip; Poster, DPG Frühjahrstagung, Dresden (Germany), 13-18 March 2011
  Toader, M.; Hietschold, M.
  
• Ultra-thin CuPc Films Investigated by a Combination of Surface Enhanced, Interference Enhanced, and Resonance Raman Spectroscopy; Talk, Optics of Surfaces and Interfaces 9 (0S19), Akumal (Mexico). 19-23 September 2011
  Ludemann, M.; Gordan, O.D.; Zahn, D.R.T.
  
• Vibrational Properties of Metal Phthalocyanine Thin Films; Poster. DPG Frühjahrstagung, Dresden (Germany), 13-18 March 2011
  Ludemann, M.; Brumboiu, I.E.; Gordan, O.D.; Zahn, D.R.T.
  
• A Critical Review: Adhesion Measurement of Thin Polymer Films for Microelectronic Applications; Talk, The Fifteenth Meeting of the Symposium on Polymers for Microelectronics, Wilmington, Delaware (USA), 8-10 May 2012
  Woehrmann, M.; M.Toepper
  
• A Raman Study of Potassium Doped Manganese Phthalocyanine: Only Charge Transfer?; Talk, International Conference on Solid Films and Surfaces 16, Genoa (Italy), 1-6 July 2012
  Ludemann, M.; Mahns, B.; Haidu, P.; Friedrich, R.; Hahn, T.; Lehmann, D.; Gordan, O.D.; Kortus, J.; Knupfer, M.; Zahn, D.R.T.
  
• Akustische Oberfiächenwellen zur Bestimmung der Haftfestigkeit dünner Schichten; Talk, 16. Deutsche Physikerinnentagung (DPT), Freiburg i. Br. (Germany), 25-28 October 2012
  Hartwig, I.
  
• ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks; Talk, EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 7 March 2012
  Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer. M.; Schulz, S,E.; Gessner, T.
  
• An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications; Talk, Materials for Advanced Metallization Conference (MAM). Grenoble (France), 11-14 March 2012
  Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, P.; Schulz, S.E.; Lang, H.; Zahn, D.R.T.; Gessner, T.
  
• Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications; Talk, 3rd International Conference on Nanotechnology: Fundamentals and Applications (ICNPA2012), Montreal (Canada), 7-9 August 2012
  Fiedler, H.; Ecke. R.; Hermann, S.; Schulz, S.E.; Gessner, T.
  
• Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study; Poster, IEEE 9th International Multi-Conference on Systems, Signals & Devices (SSD-SCI), Chemnitz (Germany), 20-23 March 2012
  Sommer, J.; Zienert, A.; Gemming, S.; Schuster, J.; Schulz, S.E.; Gessner, T.
  
• Band structure und electronic transport properties of cobalt decorated carbon nanotubes; Poster. DPG Frühjahrstagung, Berlin (Germany). 25-30 March 2012
  Sommer, J.; Zienert, A.; Schuster, J.
  
• Co/Pd multilayers on SiOx pillar arrays at ultra-high density; Talk, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Ganss, P.; Hehler, B.; Cattoni, A.; Haghtri-Gosnet, A.-M.; Albrecht, M.
  
• Comparison of lumped and finite element modeling for thermoelectric devices; Poster, Smart System Integration (SSI), Zurich (Switzerland), 21-22 March 2012
  Streit, P.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
  
• Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD; Talk, AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 17-20 June 2012
  Melzer, M.; Foerster, A.; Waechtler, T.; Wagner, C.; Fiedler, H.; Schuster, J.; Hermann, S.; Schulz, S.E.; Gessner, T.
  
• Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study; Poster, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012
  Gordan, O.D.; Lehmann, D.; Haidu, P.; Mueller, S.; Waechtler, T.; Schulz, S.E.; Lang, H.; Braun, W.; Gessner, T.; Zahn, D.R.T.
  
• Copper oxide ALD on thermally pretreated CNTs for interconnect applications; Talk, Materials for Advanced Metallization Conference (MAM), Grenoble (France). 11-14 March 2012
  Melzer, M.; Waechtler, T.; Mueller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T.; Hietschold, M.; Lang, H.
  
• Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects; ECS J. Solid State Sci. Technol. 1, pp M47-M51 (2012)
  Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1149/2.027206jss)
• Electronic and Vibrational Properties of Potassium Doped Manganese Phthalocyanine; Poster, Vth International Conference on Molecular Materials (MolMat 2012), Barcelona (Spain), 3-6 July 2012
  Mahns, B.; Ludemann, M.; Roth, P.; Kraus, R.; Grobosch, M.; Loose, C.; Friedrich, R.; Gordan, O.D.; Knupfer, M.; Kortus, J.; Zahn, D.R.T.
  
• Evaluating the adhesion of ultra-thin layers; Poster, Materials Science and Engineering (MSE) 2012, Darmstadt (Germany). 25-27 September 2012
  Hartwig, I.; Ecke, R.; Brämer, B.; Auerswald, E.; Schulz, S.E.
  
• Fabrication and characterization of CNT via interconnects for application in integrated circuits; Talk, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Schulz, S.E.; Hietschold. M.; Gessner, T.
  
• FePtCu alloy thin films; Morphology, LI 0 chemical ordering, and perpendicular magnetic anisotropy; J. Appl. Phys. 112, pp 073912 (2012)
  Brombacher, C.; Schletter, H.; Daniel, M.; Matthes, P.; Jöhrmann, N.; Maret, M.; Makarov, D.; Hietschold, M.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1063/1.4757038)
• Frequency tuning the ultrafast magnetization dynamics of FexPt100-x alloys; J. Appl. Phys. 111, pp. 053918(2012)
  Brandt, R.; Ganss, P.; Senn, T.; Daniel, M.; Albrecht, M.; Schmidt, H.
  (Siehe online unter https://doi.org/10.1063/1.3691954)
• Gold Nanoparticles Generated by Thermolysis of "All-in-One" Gold(l) Carboxylate Complexes; Dalton Trans. 41 pp 2738-2746 (2012)
  Tuchscherer, A.; Schaarschmidt, D.; Schulze, S.; Hietschold, M.; Lang, H.
  (Siehe online unter https://doi.org/10.1039/c2dt11748g)
• Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure; Carbon 50, pp 4765-4770 (2012)
  Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.carbon.2012.05.034)
• Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy; Poster, AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 17-20 June 2012
  Salvan, G.; Fronk, M.; Robaschik, P.; Zahn, D.R.T.; Albrecht, M.; Mueller, S.; Waechtler. T.; Schulz, S.E.; Mothes, R.; Lang, H.
  
• In situ spectroscopic investigation of CO accumulation and poisoning on Pd black surfaces in concentrated HCOOH: J. Power Sources 199, pp 165-169 (2012)
  Zhang, H.-X.; Wang, S.-H.; Jiang. K.; Tuchscherer, A.; Cai, W.-B.
  (Siehe online unter https://doi.org/10.1016/j.jpowsour.2011.10.033)
• Kupfer- und Ruthenium-Precursoren: Synthese, Charakterisierung und deren Venwendung zur Abscheidung metallischer Schichten nach dem CVD- Verfahren; Technische Universität Chemnitz, 2012
  Roth. N.
  
• Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition; Poster, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012
  Salvan, G.; Fronk, M.; Mueller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Schubert, C.; Albrecht, M.; Zahn. D.R.T.
  
• Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on Si02; Thin Solid Films 520, pp 4741-4744 (2012)
  Fronk, M.; Mueller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Zahn, D.R.T.; Salvan, G.
  (Siehe online unter https://dx.doi.org/10.1016/j.tsf.2011.10.204)
• Molecular Orientatin of Copper Phthalocyanine Molecules on Crystalline and Silicon Substrates; e-J. Surf. Sci. Nanotechnol. 10. pp 553-557 (2012)
  Breyer, E.T.; Lehmann, D.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1380/ejssnt.2012.553)
• Molecular Orientation of Copper phthalocyanine Molecules on Crystalline and Silicon Substrates; Poster, international Conference on Solid Films and Surfaces 16, Genoa (Italy), 1-6 July 2012
  Breyer, E.T.; Lehmann, D.; Zahn, D.R.T.
  
• Nanomaterials for Interconnects; Talk, 8th Interregional Workshop on Advanced Nanomaterials (IWAN 2012), Frankfurt (Oder) (Germany), 12-13 November 2012
  Fiedler, H.; Melzer, M.; Waechtler, T.; Hermann, S.; Schulz, S.E.; Gessner, T.
  
• Novel carbon nanotube film with a self-assembled carbon-metal heterostructure; Poster, International Conference on the Physics of Semiconductors, Dresden (Germany), 22-27 July 2012
  Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schulz, S.E.; Gessner, T.
  
• Novel form of carbon nanotube films with a self-assembled carbon-metal heterostructure; Poster, Vth International Conference on Molecular Materials (MolMat 2012), Barcelona (Spain), 3-6 July 2012
  Hermann, S.; Schulz, S.E.; Gessner, T.
  
• Optical Anisotropy and Molecular Orientation of CuPc Films and Optical Properties of Ultra-thin High-k Films; Technische Universität Chemnitz, 2012
  Ding, L.
  
• Optical Gap and Aging Effect of Ultra-thin High-k Films Grown bv Atomic Layer Deposition: Poster, 7th Workshop Ellipsometry. Leipziq (Germany), 5-7 March 2012
  Pino, L.; Chen, L.; Friedrich, M.; Gordan, O.D.; Cobet, C.; Zhang, D.W.; Esser, N.; Zahn, D.R.T.
  
• Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants; Sol. St. Phen. 187, pp 201-205 (2012)
  Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
  (Siehe online unter https://doi.org/10.4028/www.scientific.net/SSP.187.201)
• Polymerization of Thin Film Polymers; in: A. De Souza Gomes (Ed.). New Polymers for Special Applications, pp 113-138, InTech (2012)
  Woehrmann, M.; Toepper, M.
  (Siehe online unter https://doi.org/10.5772/48205)
• Processes for wafer level integration of carbon nanotubes in electronic and sensor applications; Talk. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz (Germany), 23-24 October 2012
  Hermann, S.; Fiedler, H.; Loschek, S.; Schulz, S.E.; Gessner, T.
  
• Quantum transport simulations in metallic carbon nanotubes with metal contacts; Talk, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Zienert, A.; Schuster, J.; Gessner, T.
  
• Raman Spectroscopy on Potassium Doped Manganese Phthalocyanine Thin Films; Poster, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Ludemann, M.; Mahns, B.; Gordan, O.D.; Knupfer, M.; Zahn, D.R.T.
  
• Rhodium Nanoparticles from Dirhodium(ll) Ethylene Glycol tetracarboxylates; Eur. J. Inorg. Chem. 13, pp 02251-2258 (2012)
  Tuchscherer, A.; Packheiser, R.; Rüffer, T.; Schletter, H.; Hietschold, M.; Lang, H.
  (Siehe online unter https://doi.org/10.1002/ejic.201101424)
• Self-assembled molecular arrays of distinct types of substituted metal phthalocyanines on crystalline metal substrates; Technische Universität Chemnitz, 2012
  Toader, M.
  
• Simulation of Nanostructures for Sensor and Circuit Applications; Talk, IEEE 9th International Multi-Conference on Systems, Signals & Devices (SSD-SCI), Chemnitz (Germany). 20-23 March 2012
  Zienert, A.; Wagner, C.; Mohammadzadeh, S.; Schuster, J.; Streiter, R.; Schulz, S.E.; Gessner, T.
  
• Size and Gap Dependent SERS and TERS Measurements of Phthalocyanine Molecules on Specially Designed Substrates; Talk, 4th International Conference on Nano-structures Self-Assembly (NanoSEA 2012), S. Margherita di Pula, Sardinia, (Italy), 25-29 June 2012
  Sheremet, E.; Rodriguez, R.D.; Milekhin, A.; Gordan, O.D.; Müller, S.; Villabona, S.; Ludemann, M.; Rodyakina, E.; Latyshev, A.; Zahn, D.R.T.
  
• Spectroscopic Ellipsometry and Magnetooptical Kerr Effect Spectroscopy Characterization of Phthalocyanine Thin Films on Ferromagnetic Substrates; Poster, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Fronk, M.; Haidu, F.; Ludemann, M.; Kopylov, A.; Schubert, C.; Albrecht, M.; Zahn, D.R.T.; Salvan, G.
  
• Surface enhanced Raman Scattering by Organic and Inorganic Analytes on Laterally Ordered Arrays of Au Nanoclusters; Talk, 4th International Conference on Nano-structures Self-Assembly (NanoSEA 2012), S. Margherita di Pula, Sardinia (Italy), 25-29 June 2012
  Yeryukov, N.A.; Milekhin, A.G.; Sveshnikova, L.L.; Duda, T.A.; Rodyakina, E.E.; Sheremet, E.S.; Ludemann, M.; Latyshev, A.V.; Zahn, D.R.T.
  
• Surface Modification Effect on Optical Anisotropy and Molecular Orientation of CuPc Thin Films; Poster, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Ding, L.; Friedrich, M.; Gordan, O.; Zahn, D.R.T.
  
• Synthese von Gold- und Rhodiumnanopartikeln sowie Precursorentwicklung für die chemische Gasphasenabscheidung von Ruthenium; Technische Universität Chemnitz, 2012
  Tuchscherer, A.
  
• The Influence of Substrate Magnetisation on the Molecular Orientation of CoPe; Poster, Vth International Conference on Molecular Materials (MolMat 2012), Barcelona (Spain), 3-6 July 2012
  Haidu, P.; Lehmann, D.; Fronk, M.; Mahns, B.; Ludemann, M.; Schubert, C ; Gordan, O.D.; Schäfer, P.; Knupfer, M.; Albrecht, M.; Braun, W.; Zahn, D.R.T.
  
• Three-dimensional shape dependence of spin-wave modes in single FePt nanomagnets; Phys. Rev. B 86, pp 094426 (2012)
  Brandt, R.; Ganss, P.; Rückriem, R.; Senn, T.; Brombacher, C.; Krone, P.; Albrecht, M.; Schmidt, H.
  (Siehe online unter https://doi.org/10.1103/PhysRevB.86.094426)
• Towards maximum enhancement in Raman spectroscopy; Talk, International Conference on Nanoscience + Technology (ICN+T 2012), Paris (France), 23-27 July 2012
  Sheremet, E.; Rodriguez, R.D.; Gordan, O.D.; Müller, S.; Villabona, A.; Moras, S.; Ludemann, M.; Zahn, D.R.T.
  
• Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs; Poster, DPG Frühjahrstagung, Berlin (Germany), 25-30 March 2012
  Melzer, M.; Waechtler, T.; Mueller. S.; Fiedler. H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T.; Hietschold, M.; Lang, H.
  
• Wafer level approaches for the integration of carbon nanotubes in etectronic and sensor applications; Talk, IEEE 9th International Multi-Conference on Systems, Signals & Devices (SSD-SCI), Chemnitz (Germany), 20-23 March 2012
  Hermann, S.; Fiedler, H.; Yu, H.; Loschek, S.; Bonitz. J.; Schulz, S.E.; Gessner, T.
  
• 3D Integration Technologies for MEMS based on Copper TSVs and Copper-to-Copper Metal Thermo Compression Bonding; Talk, Advanced Metallization Conference 2013 (AMC 2013). Albany, NY (USA). 21 -23 October 2013
  Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Gessner. T.
  
• 3D technologies for integration of MEMS; Talk, SEMICON Europa, Dresden (Germany), 8-10 October 2013
  Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Gessner, T.
  
• ALD of Nickel Oxide and Its Reduction to Nickel for Potential Applications in Interconnects and Spintronics; Talk, AVS 13th International Conference on Atomic Layer Deposition (ALD 2013), San Diego, CA (USA), 29-31 July 2013
  Waechtler, T.; Sharman, A.; Ahner, N.; Melzer, M.; Mueller, S.; Gummenscheimer, A.; Lehmann. D.; Schaefer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T.
  
• ALD of Transition Metals and Metal Oxides for Applications in Electronics and Sensor Devices; Talk, Symposium of the ALD Lab Dresden @ SEMICON Europa 2013, Dresden (Germany), 8 October 2013
  Waechtler, T.; Dhakal. D.; Melzer, M.; Sharma, A.; Gummenscheimer, A.; Ahner. N.; Hermann, S.; Fiedler, H.; Schulz, S.E.; Gessner, T.
  
• An Advanced MEMS Sensor Packaging Concept for Use in Harsh Environments; Talk, IEEE 15th Electronics Packaging Technology Conference, Singapore, 11-13 December 2013
  Berg, J. von; Cavalloni, C.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
  
• Bewertung von Verfahren zur Fließspannungsbestimmung in der Nanoindentation; Technische Universität Chemnitz, 2013
  Clausner, A.
  
• Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes; Microelectron. Eng. 106, pp 100-105 (2013)
  Zienert, A.; Schuster, J,; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2012.12.018)
• Conductive AFM for CNT characterization; Nanoscale Res. Lett. 8. pp 24 (2013)
  Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M.
  (Siehe online unter https://doi.org/10.1186/1556-276X-8-24)
• Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications; Microelectron. Eng. 107, pp 223-228 (2013)
  Melzer, M.; Waechtler, T.; Miiller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T.
  
• Copper(ll) and triphenylphosphine copper(l) ethylene glycol carboxylates: Synthesis, characterisation and copper nanoparticle generation; Dalton Trans. 42, pp 15599-15609 (2013)
  Adner, D.; Möckel, S.; Korb, M.; Buschbeck, R.; Rüffer, T.; Schulze, S.; Mertens, L.; Hietschold, M.; Mehring, M.; Lang, H.
  (Siehe online unter https://doi.org/10.1039/c3dt51913a)
• Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding; Semiconductor Conference Dresden-Grenoble (ISCDG), Dresden (Germany), 26-27 September 2013, Proceedings
  Baum, M.; Hofmann. L.; Wiemer, M.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/ISCDG.2013.6656329)
• Dip-pen-based direct writing of conducting silver dots; J. Colloid Interface Sci. 406, pp 256-262 (2013)
  Gilles, S.; Tuchscherer, A.; Lang, H.; Simon, U.
  (Siehe online unter https://doi.org/10.1016/j.jcis.2013.05.047)
• EBSD on thin FePtCu films to investigate the influence of copper content and annealing temperature on (001) texture formation and grain size; Talk, DPG Frühjahrstagung. Regensburg (Germany). 10-15 March 2013
  Jöhrmann, N.; Schletter, H.; Brombacher, C ; Albrecht, M.; Hietschold, M.
  
• Effects of sandwich thickness asymmetry on interface toughness measurement in the 4-point bending test; Poster, MAM - Materials for Advanced Metallization, Leuven (Belgium), 10-13 March 2013
  Hartwig, I.; Braemer, B.; Hecker, M.; Schulz, S.E.
  
• Electrical properties of Carbon Nanotube Interconnects; Poster, Materials for Advanced Metallization (MAM), Leuven (Belgium), 10-13 March 2013
  Fiedler, H.; Toader. M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Zahn, D.R.T.; Hietschold, M.; Schulz, S.E.; Gessner, T.
  
• Electron transport properties of metallic carbon nanotubes with metal contacts; Talk, DPG Frühjahrstagung, Regensburg (Germany), 10-15 March 2013
  Zienert, A.; Schuster, J.; Gessner, T.
  
• Electronic structure and transport properties of crossed carbon nanotubes; Poster, DPG Frühjahrstagung, Regensburg (Germany), 10-15 March 2013
  Teichert, P.; Zienert, A.; Schuster, J.
  
• Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts; Technische Universität Chemnitz, 2013
  Zienert, A.
  
• Electronic transport properties of metallic carbon nanotubes with metal contacts; Poster, International Winterschool on Electronic Properties of Novel Materials (IWEPNM 2013), Kirchberg in Tirol (Austria), 2-9 March 2013
  Zienert, A.; Schuster. J.; Gessner, T.
  
• Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment; J. Mater. Chem. A 1, pp 7576-7583 (2013)
  Luo, J.; Billep, D.; Waechtler, T.; Otto, T.; Toader, M.; Gordan, O.; Sheremet, E.; Martin, J.; Hietschold, M.; Zahn, D.R.T.; Gessner, T.
  (Siehe online unter https://doi.org/10.1039/c3ta11209h)
• Extended Hückel Theory for Carbon Nanotubes: Band Structure and Transport Properties; J. Phys. Chem. A 117, pp 3650-3654 (2013)
  Zienert, A.; Schuster, J.; Gessner, T.
  (Siehe online unter https://doi.org/10.1021/jp312586j)
• Hexacarbonyl (trimethylsilyl ethyne) dicobalt as MOCVD precursor for thin cobalt layer formation; Z. Anorg. Allg. Chem. 639, pp 2532-2535 (2013)
  Georgi, C.; Hildebrandt, A.; Tuchscherer, A.; Oswald, S.; Lang, H.
  (Siehe online unter https://doi.org/10.1002/zaac.201300292)
• Hierarchical MoSz/polyaniline nanowires with excellent electrochemical performance for lithium-ion batteries; Adv. Mater. 25. pp 1180-1184 (2013)
  Yang, L.; Wang, S.; Mao, J.; Deng, J.; Gao, Q.; Tang, Y.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201203999)
• Highly conductive and strainreleased hybrid multilayer Ge/Ti nanomembranes with enhanced lithium-ionstorage capability; Adv. Mater. 25, pp 539-544 (2013)
  Yan, C.; Xi, W.; Si, W.; Deng, J.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201203458)
• In-situ XPS investigation of the surface chemistry of a Cu(l) Beta-Diketonate precursor with reference to the ALD of Cu20; Poster, 17. Tagung Festkörperanalytik (FKA 17), Chemnitz (Germany), 1 -3 July 2013
  Dhakal, D.; Waechtler. T.; Melzer, M.; Mothes, R.; Schulz, S.E.; Lang, H.; Gessner, T.
  
• Influence of DMSO and MWCNTs addition on the thermoelectric properties of PEDOT:PSS thin films; Poster. Smart Systems Integration - SSI 2013, Amsterdam (The Netherlands), 13-14 March 2013
  Luo, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T.
  
• Influence of the annealing atmosphere on the structural properties of FePt thin films; J. Appl. Phys. 114, pp 164314 (2013)
  Vladymyrski, I.A.; Karpets, M.V.; Ganss, P.; Katona, G.L.; Beke, D.L.; Sidorenko, S.I.; Nagata, T.; Nabatame, T.; Chikyow, T.; Beddies, G.; Albrecht, M.; Makogon, I.M.
  (Siehe online unter https://doi.org/10.1063/1.4827202)
• Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films; Phys. Stat. SoL A210, pp 140-146 (2013)
  Daniel, M.; Friedemann, M.; Jöhrmann, N.; Liebig, A.; Dönges, J.; Hietschold, M.; Beddies, G.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1002/pssa.201228388)
• Investigation of Spin Waves in Magnetic Nanocaps; Poster, 526th WE Heraeus Seminar on Functional Magnetic Nanomembranes. Bad Honnef (Germany), 04-06 March 2013
  Rückriem, R.; Brandt, R.; Ganss. P.; Senn, T.; Gilbert. D.A.; Liu, K.; Brombaeher, C.; Krone, P.; Schmidt, H.; Schrefl, T.; Albrecht, M.
  
• Investigations on partially filled HAR TSVs for MEMS applications; Talk, 2013 IEEE International Interconnect Technology Conference (IITC), Kyoto (Japan), 13-15 June 2013, Proceedings, ISBN: 978-1-4799-0438-9
  Hofmann, L.; Schubert, I.; Gottfried, K.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/IITC.2013.6615585)
• Low resistance carbon nanotube - metal contact for interconnect applications; Poster, The Fourteenth International Conference on the Science and Application of Nanotubes (NT13), Espoo (Finland), 24-28 June 2013
  Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Zahn, D.R.T.; Hietschold, M.; Schulz, S.E.; Gessner, T.
  
• Magneto-optical Kerr effect studies of Cu20/nickel heterostructures; Microelectron. Eng. 107, pp 130-133 (2013)
  Salvan, G.; Robaschik, P.; Fronk, M.; Miiller, S.; Waechtler, T.; Schulz. S.E.; Mothes, R.; Lang, H.; Schubert, C.; Thomas, S.; Albrecht, M.; Zahn, D.R.T.
  (Siehe online unter https://dx.doi.org/10.1016/j.mee.2012.10.023)
• Manipulation of Ni catalyst particle size, shape and areal density on TIN support layer for growth of vertical aligned CNTs; Poster, NT13 - The Fourteenth International Conference on the Science and Application of Nanotubes, Helsinki (Finland), 24-28 June 2013
  Tittmann, J.; Hermann, S.; Fiedler, H.; Schulz, S.E.; Gessner, T.
  
• Mechanical properties of polymers and their relevance to reliability of microelectronics; Poster, Thermoset 2013 - From Monomers to Components, Berlin (Germany), 18-20 September 2013
  Woehrmann, M.; Walter, H.; Töpper, M.; Lang, K.-D.
  
• Naturally Rolled-up C/Si/C Trilayer Nanomembranes as Stable Anodes for Lithium Ion Batteries with Remarkable Cycling Performance; Angew. Chem. InL Ed. 52. pp 2326-2330 (2013)
  Deng, J.; Ji, H.; Yan, C ; Zhang, J.; Si, W.; Baunack, S.; Oswald, S.; Mei, Y.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/anie.201208357)
• On chip, all solid-state and flexible micro-supercapacitors with high performance based on MnOx/Au multilayers; Energy Environ. Sci. 6, pp 3218-3223 (2013)
  Si, W.; Yan, C.; Chen. Y.; Oswald, S.; Han, L.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1039/c3ee41286e)
• Optimizing EBSD setup for high lateral resolution to investigate thin (FePt)l-xCux films; Poster, Microscopy Conference 2013, Regensburg (Germany), 25-30 August 2013, Proceedings, pp 629-630 (2013)
  Jöhrmann, N.; Brombacher, C.; Albrecht, M.; Hietschold, M.
  
• Particle-free gold metal-organic decomposition ink for Inkjet printing of gold structures; Thin Solid Films 531, pp 147-151 (2013)
  Schoner, C.; Tuchscherer, A.; Blaudeck, T.; Jahn, S.F.; Baumann, R.R.; Lang, H.
  (Siehe online unter https://doi.org/10.1016/j.tsf.2013.01.027)
• Preparation and Characterization of Carbon Nanotubes based Via Interconnects; Poster, Ninth International Nanotechnology Conference on Communication and Cooperation (INC 9), Berlin (Germany), 14-17 May 2013
  Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Zahn, D.R.T.; Hietschold, M.; Schulz, S.E.; Gessner, T.
  
• Sandwich-stacked SnO2/Cu hybrid nanosheets as multichannel anodes for lithium ion batteries; ACS Nano 7, pp 6948-6954 (2013)
  Deng, J.; Yan, C ; Yang, L.; Baunack, S.; Oswald, S.; Wendrock, H.; Mei, Y.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1021/nn402164q)
• Size-dependent magnetization switching characteristics and spin wave modes of FePt nanostructures; J. Appl. Phys. 113. pp 203910 (2013)
  Brandt, R.; Rückriem, R.; Gilbert, D.A.; Ganss, P.; Senn, T.; Liu, K.; Albrecht, M.; Schmidt, H.
  (Siehe online unter https://doi.org/10.1063/1.4807930)
• Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications; Talk, Thermoset 2013 - From Monomers to Components, Berlin (Germany), 18-20 September 2013
  Woehrmann, M.; Töpper, M.; Lang, K.-D.
  
• Surface enhanced Raman scattering by organic and inorganic semiconductors formed on laterally ordered arrays of Au nanoclusters; Thin Solid Films 543, pp 35-40 (2013)
  Milekhin, A.G.; Yeryukov, N.A.; Sveshnikova, L.L.; Duda, T.A.; Rodyakina, E.E.; Sheremet, E.S.; Ludemann, M.; Gordan, O.D.; Latyshev, A.V.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1016/j.tsf.2013.03.070)
• Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung; Poster, Mikrosystemtechnik-Kongress, Aachen (Germany), 14-16 October 2013
  Meinecke, C.; Hofmann, L.; Bertz, A.; Gottfried, K.; Gessner, T.
  
• Texturuntersuchungen an 5 nm dünnen (FePt)l-xCux-Filmen; Talk, 17. Tagung Festkörperanalytik (FKA 17), Chemnitz (Germany), 01-03 July 2013
  Jöhrmann, N.; Brombacher, C ; Albrecht, M.; Hietschold, M.
  
• Three-dimensionally curved NiO nanomembranes as ultrahigh rate capability anodes for li-ion batteries with long cycle lifetimes; Adv. Energy Mater. 4, pp 1300912 (2013)
  Sun, X.; Yan, C.; Chen, Y.; Si, W.; Deng, J.; Oswald, S.; Liu, L.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/aenm.201300912)
• Tin oxide nanoparticles and Sn02/Si02 hybrid materials by twin polymerization using tin(IV) alkoxides; ChemPlusChem 78, pp 1400-1412 (2013)
  Leonhardt, C.; Brumm, S.; Seifert, A.; Cox, G.; Lange, A.; Rüffer, T.; Schaarschmidt, D.; Lang, H.; Jöhrmann, N.; Hietschold, M.; Simon, P.; Mehring, M.
  (Siehe online unter https://doi.org/10.1002/cplu.201200242)
• TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS; Talk, Mikrosystemtechnik-Kongress, Aachen (Germany), 14-16 October 2013. Proceedings, ISBN: 978-3-8007-3555-6
  Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T.
  
• Vertical Integration techniques for MEMS using HAR TSV; Talk, Smarts Systems Integration (SSI), Amsterdam (The Netherlands), 13-14 March 2013, Proceedings, ISBN: 978-3-8007-3490-0
  Hofmann, L.; Schubert, I.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Gessner, T.
  
• Wetting Optimized Solutions for Plasma Etch Residue Removal for Application in Interconnect Systems of Integrated Circuits; Technische Universität Chemnitz, 2013
  Ahner, N.
  
• A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems; J. Mater. Chem. C 2, pp 4676-4682 (2014)
  Georgi, C ; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
  (Siehe online unter https://doi.org/10.1039/c4tc00288a)
• A highly flexible and compact magnetoreslstive analytic device; Lab chip 14. pp 4050-4058 (2014)
  Lin, G.; Makarov, D.; Melzer, M.; Si, W.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1039/c4lc00751d)
• A single rolled-up Si tube battery for study of electrochemical kinetics, electrical conductivity and structural integrity; Adv. Mater. 26, pp 7973-7978 (2014)
  Si, W.; Mönch, I.J.; Yan, C.; Deng, J.; Li, S.; Lin, G.; Han, L.; Mei, Y.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201402484)
• Adjustment of Carbon Nanotube Properties for Sensor Applications using Pd Adatoms: An Ab-initio Study; Talk, DPG Frühjahrstagung, Dresden (Germany), 30 March - 4 April 2014
  Fuchs, P.; Wagner, C.; Zienert, A.; Schuster, J.
  
• ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics; Talk, Materials for Advanced Metallization Conference (MAM 2014), Chemnitz (Germany), 2-5 March 2014
  Waechtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schaefer, P.; Schulze, S.; Schulz, S.E.; Zahn. D.R.T.; Hietschold, M.; Gessner, T.
  
• Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes; Microelectron. Eng. 120, pp 210-215 (2014)
  Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Zahn, D.R.T.; Hietschold, M.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2013.07.007)
• Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics; 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando (FL, USA), 27-30 May 2014, Proceedings, pp 1421-1426
  Woehrmann, M.; Fischer, T.; Walter, H.; Toepper. M.; Lang, K.-D.
  (Siehe online unter https://doi.org/10.1109/ECTC.2014.6897480)
• Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films; J. Appl. Phys. 115, pp 054908 (2014)
  Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, D.R.T.; Toader, M.; Hietschold. M.; Otto. T.; Gessner, T.
  (Siehe online unter https://doi.org/10.1063/1.4864749)
• Electron microscopic studies of low-k inter-metal dielectrics; Technische Universität Chemnitz. 2014
  ingh, P.
  
• Electronic transport properties of metallic carbon nanotubes with metal contacts: size effects and contact resistance; Talk, QuantumHagen: Workshop on Modeling of Electronic Devices and Materials at the Nanoscale, Copenhagen (Denmark), 1-3 July 2014
  Zienert, A.; Schuster, J.; Gessner, T.
  
• Electronic Transport Properties of Metallic Carbon Nanotubes with Metal Contacts; Poster, First Annual DCCMS Workshop, Dresden (Germany), 20 October 2014
  Zienert, A.; Schuster, J.; Gessner, T.
  
• Electronic Transport Properties of Metallic Carbon Nanotubes with Metal Contacts; Poster, International CECAM- Workshop-Tutorial "High performance models of charge transport in large scale systems", Bremen (Germany), 5-10 October 2014
  Zienert, A.; Schuster, J.; Gessner, T.
  
• Electronic transport through defective carbon nanotubes; Poster, International Winterschool on Electronic Properties of Novel Materials (IWEPNM 2013), Kirchberg in Tirol (Austria), 8-15 March 2014
  Teichert, P.; Zienert, A.; Schuster, J.
  
• Electronic transport through defective carbon nanotubes; Talk, DPG Frühjahrstagung, Dresden (Germany), 30 March - 4 April 2014
  Teichert, P.; Zienert, A.; Schuster, J.
  
• Evaluation and Signal Conditioning of piezoresistive Silicon Pressure Sensor; Appl. Mech. Mater. 530-531, pp 28-32 (2014)
  Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
  (Siehe online unter https://doi.org/10.4028/www.scientific.net/AMM.530-531.28)
• Free-standing Fe203 nanomembranes as anodes for Li-ion batteries with long cycling life and high rate capability; Sci. Rep. 4, pp 7452 (2014)
  Liu, X.; Si, W.; Sun, X.; Deng, J.; Zhang, J.; Baunack, S.; Oswald, S.; Liu, L.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1038/srep07452)
• Growth temperature effect on the structure of CoPt islands on NaCI(OOI) studied by grazing-incidence small-angle X-ray scattering; J. Appl. Cryst. 47, pp 102-109 (2014)
  Maret, M.; Liscio, F.; Makarov, D.; Doisneau-Cottignies, B.; Ganss, P.; Missiaen, J.-M.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1107/S1600576713028112)
• Hierarchically designed SiOx/SiOv bilayer nanomembranes as stable anodes for lithium ion batteries: Adv. Mater. 26, pp 4527-4532 (2014)
  Zhang, L; Deng, J.: Liu, L.: Si, W.: Oswald, S.: Xi, L.: Kundu, M.; Ma, G.: Gemming, T.; Baunack, S.: Ding, P.; Yan, C : Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/adma.201401194)
• High areal capacity, micrometer-scale amorphous Si film anode based on nanostructured Cu foil for Li-ion batteries; J. Power Sources 267, pp 629-634 (2014)
  Si, W.; Sun, X.; Liu, X.; Xi, L.; Jia, Y.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1016/j.jpowsour.2014.05.136)
• Hybrid Josephson Junctions with Iron-based and Conventional Superconductor Electrodes; J. Supercond. Nov. Magn. 28, pp 1117-1121 (2014)
  Döring, S.; Schmidt, S.; Reifert, D.; Feltz, M.; Monecke, M.; Hasan, N.; Tympel, V.; Schmidl, F.; Engelmann, J.; Kurth. F.; lida, K.; Mönch, I.; Holzapfel, B.; Seidel, P.
  (Siehe online unter https://doi.org/10.1007/s10948-014-2719-5)
• In-situ growth monitoring of ultrathin films of ALD Cu20 and Cu after successive reduction; Talk, 2nd International Conference on ALD Applications & 3rd China ALD conference, Shanghai (China), 16-17 October 2014
  Dhakal, D.; Waechtler, T.; Schulz, S.E.; Moeckel, S.; Lang, H.; Gessner, T.
  
• In-situ XPS Investigation of ALD Cu20 and Cu Thin Films after Successive Reduction; Talk, 14th International Conference on Atomic Layer Deposition (ALD 2014). Kyoto (Japan). 15-18 June 2014
  Dhakal, D.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Moeckel, S.; Lang, H.; Gessner, T.
  
• In-situ XPS investigation of the surface chemistry of a Cu(l) beta-diketonate precursor and the ALD of Cu20; Poster, Materials for Advanced Metallization Conference (MAM 2014), Chemnitz (Germany), 2-5 March 2014
  Dhakal, D.; Waechtler, T.; Mothes, R.; Schulz, S.E.; Lang, H.; Gessner, T.
  
• Influence of the substrate choice on the L10 phase formation of post-annealed Pt/Fe and Pt/Ag/Fe thin films; J. Appl. Phys. 116 (4), pp 044310 (2014)
  Vladymyrskyi, I.A.; Karpets, M.V.; Katona, G.L.; Beke, D.L.; Sidorenko, S.I.; Nagata, T.; Nabatame, T.; Ganss, P.; Beddies, G.; Chikyow, T.; Albrecht, M.; Makogon, I.M.
  (Siehe online unter https://doi.org/10.1063/1.4891477)
• Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing; Talk, Materials for Advanced Metallization (MAM 2014), Chemnitz (Germany), 2-5 March 2014
  Fuchs, P.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E.
  (Siehe online unter https://doi.org/10.1016/j.mee.2015.02.003)
• Interference-Enhanced Raman Scattering of Ultrathin CuPc Film; Poster, Surface-Enhanced Spectroscopies 2014 (SES 2014), Chemnitz (Germany), 7-10 August 2014
  Solonenko, D.; Gordan, O.D.; Zahn, D.R.T.
  
• Interference-Enhanced Raman Spectroscopy of CuPc and F16CuPc Thin Films; Talk, Summer School Epioptics-13 and Silicene-1, Erice (Italy). 26 July - 1 August 2014
  Solonenko, D.; Gordan, O.D.; Milekhin, A.G.; Panholzer, M.; Hinged, K.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1088/0022-3727/49/11/115502)
• Investigation of TiOx barriers for their use in hybrid Josephson and tunneling junctions based on pnictide thin films; J. Appl. Phys. 115, pp 083901 (2014)
  Döring, S.; Monecke, M.; Schmidt, S.; Schmidl, F.; Tympel, V.; Engelmann, J.; Kurth, F.; lida, K.; Haindl, S.; Mönch, I.; Holzapfel, B.; Seidel. P.
  (Siehe online unter https://doi.org/10.1063/1.4863172)
• Kerr- and Faraday microscope for space- and time-resolved studies; Eur. Phys. J. B 87, pp 219 (2014)
  Schmitt, O.; Steil, D.; Alebrand, S.; Ganss, P.; Hehn, M.; Mangin, S.; Albrecht, M.; Mathias, S.; Cinchetti, M.; Aeschlimann, M.
  (Siehe online unter https://doi.org/10.1140/epjb/e2014-50257-3)
• Localization length of integrated multi-walled carbon nanotubes; 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), San Jose, CA (USA), 20-23 May 2014, Proceedings, pp 159-162
  Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1109/IITC.2014.6831852)
• Mechanical Properties of Individual Composite Poty(methyl-methacrylate)-Multiwalled Carbon Nanotubes Nanofibers; Talk, NANOSTRUC 2014: International Conference on Structural Nano Composites, Madrid (Spain), 20-21 May 2014
  Grabbert, N.; Avnon, A.; Wang, B.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Ngo, H.-D.; Kaletta, K.; Zhuo, S.; Lang, K.-D.
  (Siehe online unter https://doi.org/10.1088/1757-899X/64/1/012005)
• Mechanism for the atomic layer deposition (ALD) of copper oxide from (nBu3P)2Cu(acac) and wet O2: a theoretical study; Poster, 14th International Conference on Atomic Layer Deposition. Kyoto (Japan), 15-18 June 2014
  Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
  
• Mechanism of Stabilization in Ultrasmall CdS Nanoparticles Studied by FT-IR and Raman Spectroscopy; Poster. International Conference on Quantum Dots-2014, Pisa (Italy), 11-16 May 2014
  Solonenko, D.; Poppitz, E.; Lang, H.; Dzhagan, V.; Raevskaya, O.; Stroyuk, O.; Lehmann. D.; Gordan, O.D.; Zahn, D.R.T.
  
• Metallic carbon nanotubes with metal contacts: electronic structure and transport; Nanotechnology 25 (42), pp 425203 (2014)
  Zienert, A.; Schuster, J.; Gessner, T.
  (Siehe online unter https://doi.org/10.1088/0957-4484/25/42/425203)
• Mode-Selective Interference-Enhanced Raman Scattering of F16CuPc Thin Film; Poster, 24th International Conference on Raman Spectroscopy (ICORS 2014), Jena (Germany), 10-15 August 2014
  Solonenko, D.; Gordan, O.D.; Milekhin, A.G.; Panholzer, M.; Hingerl, K.; Zahn, D.R.T.
  
• Multifunctional Ni/NiO hybridized nanomembranes as anode materials for highrate Li-ion batteries; Nano Energy 9, pp 168-175 (2014)
  Sun, X.; Si, W.; Liu, X.; Deng, J.; Xi, L.; Liu, L.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1016/j.nanoen.2014.06.022)
• Neues Drucksensorkonzept mit Glasdurchführung (TGV) und Druckbeaufschlagung auf der Rückseite der Si-Membran für den Einsatz in aggressiven Umgebungen; Poster, IEEE Sensors 2014, Nürnberg (Germany), 2-5 November 2014
  Mukhopadhyay, B.; Mackowiak, P.; Fritz, M.; Vu, T. Cong; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
  
• Optical Properties and Electrical Transport of Thin Films of Terbium(tll)bis(phthalocyanine) on Cobalt; Beilstein J. Nanotechnol. 5, pp 2070-2078(2014)
  Robaschik, P.; Siles, P.F.; Bülz, D.; Richter, P.; Monecke, M.; Fronk, M.; Klyatskaya, S.; Grimm, D.; Schmidt, O.G.; Ruben. M.; Zahn, D.R.T.; Salvan, G.
  (Siehe online unter https://doi.org/10.3762/bjnano.5.215)
• Preparation and characterization of Carbon Nanotube based vertical interconnections for integrated circuits; Technische Universität Chemnitz, 2014
  Fiedler, H.
  
• Preparation of hybrid Josephson junctions on Co-doped Ba-122 single crystals; Supercond. Sci. Tech. 27. pp 085003 (2014)
  Reifert, D.; Hasan, N.; Döring, S.; Schmidt, S.; Monecke, M.; Feltz, M.; Schmidl, F.; Tympel, V.; Wisniewski, W.; Mönch, I.; Wolf, T.; Seidel, P.
  (Siehe online unter https://doi.org/10.1088/0953-2048/27/8/085003)
• Raman and AFM Characterization of Ultrasmall CdS Nanoparticles Incorporated in Polymerie Matrix; Poster, DPG Frühjahrstagung 2014, Dresden (Germany), 30 March - 4 April 2014
  Solonenko, D.; Dzhagan, V.; Rayevskaya, O.; Stroyuk, O.; Gordan, O.D.; Zahn, D.R.T.
  
• Raman and Infrared Phonon Spectra of Ultrasmall Colloidal CdS Nanoparticles; J. Phys. Chem. C 118. pp 19492 (2014)
  Dzhagan, V.; Valakh, M.Ya; Himcinschi, C.; Milekhin, A.G.; Solonenko, D.; Yeryukov, A.; Raevskaya, O.E.; Stroyuk, O.L.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1021/jp506307q)
• Schottky contact on ultra-thin silicon nanomembranes under light illumination; Nanotechnology 25, pp 485201 (2014)
  Song, E.: Si, W.; Cao, R.; Feng, P.: Mönch, I.; Huana, G.; Di, Z.: Schmidt, O.G.: Mei, Y.
  (Siehe online unter https://doi.org/10.1088/0957-4484/25/48/485201)
• Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface; Poster, Materials for Advanced Metallization (MAM 2014), Chemnitz (Germany), 2-5 March 2014
  Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
  
• Single vortex core recording in a magnetic vortex lattice; J. Appl. Phys. 115, pp 063906 (2014)
  Mitin, D.; Nissen, D.; Schädlich, P.; Arekapudi, S.S.P.K.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1063/1.4865746)
• Structural, Magnetic, and Magneto-optical Properties of Sputtered and Annealed La0.66Sri0.34MnO3 Thin Films on Silicon; Poster, EMRS Fall Meeting 2014, Warsaw (Poland). 15-18 September 2014
  Monecke, M.; Robaschik, P.; Richter, P.; Banerjee, S.; Salvan, G.; Zahn, D.R.T.
  
• Surface chemistry of a Cu(l) beta-diketonate precursor and the atomic layer deposition of CuzO on Si02 studied by x-ray photoelectron spectroscopy; J. Vac. Sci. Technol. A 32, pp 041505 (2014)
  Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A.
  (Siehe online unter https://doi.org/10.1116/1.4878815)
• Surface Chemistry of Cu(ll) Acetylacetonate on Cu(110) Surface from Reactive Molecular Dynamics and First-principles; Poster. 2nd International Conference on ALD Applications & 3rd China ALD conference, Shanghai (China), 16-17 October 2014
  Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
  
• Synthesis and luminescent properties of ultrasmall colloidal CdS nanoparticles stabilized by Cd(ll) complexes with ammonia and mercaptoacetate; J. Nanopart. Res. 16, pp 2625 (2014)
  Raevskaya, A.E.; Stroyuk, O.L.; Solonenko, D.I.; Dzhagan, V.M.; Lehmann, D.; Kuchmiy, S.Ya; Plyusnin, V.F.; Zahn, D.R.T.
  (Siehe online unter https://doi.org/10.1007/s11051-014-2650-5)
• Thermodynamics and Kinetics of CU2O ALD from Cu(l) Acetylacetonate; Talk, 2nd International Conference on ALD Applications & 3rd China ALD conference. Shanghai (China), 16-17 October 2014
  Hu, X.; Schuster, J.; Schulz. S.E.; Gessner, T.
  
• Transmission Kikuchi Diffraction and Selected Area Electron Diffraction studies of WS2 nanotubes; Poster, DPG Frühjahrstagung, Dresden (Germany), 30 March-4 April 2014
  Chkanov, A.; Khadiev, A.; Jöhrmann, N.; Pashin, D.; Hietschold, M.
  
• Wireless Pressure Sensor System; Appl. Mech. and Mater. 530-531, pp 75-78 (2014)
  Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
  (Siehe online unter https://doi.org/10.4028/www.scientific.net/AMM.530-531.75)
• A Novel Dicobaltatetrahedrane Precursor Studied for the MOCVD of Cobalt Metal Layers; Poster, International Interconnect Technology Conference / Materials forAdvanced Metallization Conference, Grenoble (France). 18-21 May 2015
  Kaspar, M.; Waechtler, T.; Ecke, R.; Georgi, C.; Schulz, S.E.; Lang, H.; Gessner, T.
  
• Designing Electrochemical Energy Storage Microdevices: Li-lon Batteries and Flexible Supercapacitors; Technische Universität Chemnitz, 2015
  Si, W.
  
• Diffusion and solid state reactions in Fe/Ag/Pt and FePt/Ag thin-film systems; J. Phys. D: Appl. Phys. 48, pp 175001 (2015)
  Katona, G.L.; Safonova, N.Y.; Ganss, P.; Mitin, D.; Vladymyrskyi, I.A.; Sidorenko, S.I.; Makogon, lu.N.; Beddies, G.; Albrecht, M.; Beke, D.L.
  (Siehe online unter https://doi.org/10.1088/0022-3727/48/17/175001)
• Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts; Talk, AIMR International Symposium 2015 (AMIS2015), Sendai (Japan), 16-19 February 2015
  Zienert, A.; Schuster, J.; Gessner, T.
  
• High-rate amorphous SnO2 nanomembrane anodes for Li-ion batteries with a long cycling life; Nanoscale 7, pp 282-288 (2015)
  Liu, X.; Zhang, J.; Si, W.; Oswald. S.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1039/c4nr04903a)
• In Situ Raman Investigation of Silence; Poster, DPG Frühjahrstagung 2015, Berlin (Germany), 15-20 March 2015
  Solonenko, D.; Vogt, P.; Gordan, O.D.; Zahn, D.R.T.
  
• In Situ-Formed, Amorphous, Oxygen-Enabled Germanium Anode with Robust Cycle Life for Reversible Lithium Storage; ChemElectroChem 2, pp 737-742 (2015)
  Sun, X.; Si, W.; Xi, L.; Liu, B.; Liu, X.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/celc.201402404)
• Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments; Talk, IEEE Sensors 2015, Nürnberg (Germany), 1-4 November 2016
  Mackowiak, P.; Meinecke, P.; Mukhopadhyay, B.; Hoang, T.H.; Dao, Q.-C; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
  (Siehe online unter https://dx.doi.org/10.5162/sensor2015/D4.2)
• Investigation of Polymer Based Materials in Thermoelectric Applications; Technische Universität Chemnitz, 2015
  Luo, J.
  
• Magnetotransport Properties of Perpendicular [Co/Pt]/Cu/[Co/Pt] Pseudo-Spin- Valves; IEEE Trans. Magn. 51, pp 4400104 (2015)
  Matthes, P.; Arekapudi, S.S.P.K.; Timmermann. F.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1109/TMAG.2014.2359871)
• Monte Carlo simulations for Transmission Kikuchi Diffraction; Talk, DPG Frühjahrstagung 2015, Berlin (Germany). 15-20 March 2015
  Jöhrmann, N.; Hietschold, M.
  
• Next Generation Thin Film Polymers for WLP Applications and their Mechanical Characterization; Talk, IMAPS 11th International Conference on Device Packaging, Scottsdale AZ, (USA), 17-19 March 2015
  Woehrmann, M.; Toepper, M.; Walter, H.; Lang, K.-D.
  (Siehe online unter https://doi.org/10.4071/2015DPC-tp25)
• Performance Li-Oz Batteries with Trilayered Pd/MnOx/Pd Nanomembranes; Advanced Science 2015, pp 1500113 (2015)
  Lu, X.; Deng, J.; Si, W.; Sun, X.; Liu, X.; Liu, B.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1002/advs.201500113)
• Role of antiferromagnetic spin configuration in dual exchange biased structure in [Pt/Co]6/CoO/[Co/Pd]8 system; Talk, DPG Frühjahrstagung 2015, Berlin (Germany), 15-20 March 2015
  Arekapudi, S.S.P.K.; Mitin, D.; Albrecht, M.
  
• Sandwich nanoarchitecture of Si/reduced graphene oxide bilayer nanomembranes for Li-ion batteries with long cycle life; ACS Nano 9, pp 1198-1205 (2015)
  Liu, X.; Zhang, J.; Si, W.; Xi, L.; Eiehler, B.; Yan, C.; Schmidt, O.G.
  (Siehe online unter https://doi.org/10.1021/nn5048052)
• Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta{110) surface; Microelectron. Eng. 137, pp 23-31 (2015)
  Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
  (Siehe online unter https://doi.org/10.1016/j.mee.2015.02.017)
• Strain engineered nanomembranes as anodes for lithium ion batteries; Technische Universität Chemnitz, 2015
  Deng, J.
  
• Structural and thermoelectric properties of FeSb3 skutterudite thin films; Phys. Rev. B 91, pp 085410(2015)
  Daniel, M.V.; Hammerschmidt, L.; Schmidt, C.; Timmermann, F.; Franke, J.; Jöhrmann, N.; Hietschold, M.; Johnson, D.C.; Paulus, B.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1103/PhysRevB.91.085410)
• Structural properties of thermoelectric CoSb3 skutterudite thin films prepared by molecular beam deposition; J. Alloys Comp. 624, pp 216-225 (2015)
  Daniel, M.V.; Brombacher, C.; Beddies, G.; Jöhrmann, N.; Hietschold, M.; Johnson, D.C.; Aabdin, Z.; Peranio, N.; Eibl, O.; Albrecht, M.
  (Siehe online unter https://doi.org/10.1016/j.jallcom.2014.11.057)
• Towards type-selective SWCNTs growth: Comparative study on characterization techniques for an effective CVD process development; Poster, The 16th International Conference on the Science and Application of Nanotubes (NT15), Nagoya (Japan), 29 June - 3 July 2015
  Jafarpour, S.M.; Kini, M.; Hermann, S.; Schulz, S.E.
  
• Über chirale Phosphinoferrocene und deren Anwendung in der (atropselektiven) Synthese räumlich gehinderter Biaryle über eine Suzuki-Miyaura-Reaktion; Technische Universität Chemnitz, 2015
  Schaarschmidt, D.
  
• Annealing Effects on Sputtered La0.66Sr0.34MnO3 Thin Films on Silicon; Talk, DPG Frühjahrstagung 2015, Berlin (Germany), 15-20 March 2016
  Monecke, M.; Richter, P.; Robaschik, P.; Banerjee, S.; Salvan, G.; Zahn, D.R.T.