Multi-target ultra-high-vacuum (UHV) RF Sputtering System

• Fachliche Zuordnung: Physik der kondensierten Materie
• Förderung: Förderung in 2015
• Projektkennung: Deutsche Forschungsgemeinschaft (DFG) - Projektnummer 282221095

The head of the group is a researcher of topological insulators (TIs) and topological superconductors (TSCs). Our group has been doing research at Osaka University, but is moving to the University of Cologne to focus more on the fundamental physics of TIs and TSCs. One of the objectives of our research is to discover novel quantum phenomena in TIs and TSCs, which requires fabrications of state-of-the-art devices based on these materials. For this purpose, the University of Cologne will build a dedicated clean room for our group. The RF sputtering system is a general and essential tool for depositing metals and insulators in the nano-device fabrication process. Needless to say, such a process must be done within the same clean room as the other lithography processes. Therefore, an RF sputtering system is a necessary apparatus in a clean room for nanodevice fabrications.

• DFG-Verfahren: Forschungsgroßgeräte
• Großgeräte: Multi-target ultra-high-vacuum (UHV) RF Sputtering System
• Gerätegruppe: 8330 Vakuumbedampfungsanlagen und -präparieranlagen für Elektronenmikroskopie
• Antragstellende Institution: Universität zu Köln
• Leiter: Professor Dr. Yoichi Ando