Project Details
Projekt
SiCer-Technology for RF-MEMS
Applicant
Professor Dr.-Ing. Jens Müller
Subject Area
Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term
from 2012 to 2019
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 169536409
The project SiCer-Technology for RF-MEMS is a sub project (TP-C2) of the research unit MUSIK (FOR1522). Its research focus will be the technological implementation of microelectronic and MEMS functionalities for MUSIK which pursues a holistic approach for the multi-physical modelling and synthesis of complex high-frequency circuits. Core technology for the substrate based implementation is a Silicon-Ceramic-Compound Technology (SiCer) which was originally invented at the Institute of Micro- and Nanotechnologies MacroNano® of the TU Ilmenau. SiCer represents a direct combination of silicon micromechanics and multilayer low temperature ceramic technology (LTCC). In principle, microelectromechanical rf-components have the potential to reduce semiconductor related losses. The interface between chip and chip carrier is most critical in terms of systems integration. The aim of MUSIK is to integrate silicon based microelectronic as well as microelectromechanical components together with their external periphery on one functional substrate and to develop adequate design procedures. Silicon and a special siliconadapted LTCC are bonded together by sintering prior to silicon micromachining steps. Therefore the MEMS components are already an integral part of the substrate which can be processed in wafer level format. Critical assembly steps of fragile MEMS components are omitted. This concepts improves the integration density of functional elements, simplifies hermetic packaging processes of the system and reduces parasitic properties due to short interconnects. The aim of sub-project TP-C2 in phase 2 of MUSIK is the integration of allmicroelectromechanical rf-sub-modules into one system using SiCerand packaging technologies. In order to achieve this goal a further enhancement and completion of assembly and packaging technologies which were developed in phase 1 of MUSIK aremandatory. Together with sub-project TP-C1 novel vertical interconnect technologies and pressure less bonding processes will be developed which increase the potential to implement new functional structures. In addition metal-semiconductor-contacts at thebond interface between silicon and LTCC will be evaluated with respect to their use as non-linear rf-components and the functionalintegration capability of high-k materials as capacitors will be investigated. The sub-project is complemented by a work package dedicated to the investigation of reliability and reproducibility of the SiCer-technology.
DFG Programme
Research Units
