ICP-RIE plasma etching machine

• Subject Area: Particles, Nuclei and Fields
• Term: Funded in 2018
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 414743279

The ICP-RIE plasma etching machine will be mainly used to fabricate metallic magnetic calorimeters (MMCs) as well as superconducting quantum interference devices (SQUIDs). Furthermore, the system will be used to develop and implement new fabrication processes which allows to make existing microfabrication processes more reliable and reproducible to ultimately increase the yield of the fabrication of MMCs and SQUIDs. On the other hand, we want to extend the fabrication abilities to allow to realize new detector concepts. The ICP-RIE plasma etching system will particularly be used to etch different metals such as Nb, Al, Au, dielectrics such as silicon oxide or silicon nitride as well as to etch silicon. The thickness of the layer to be etched ranges from several nanometers to several microns and in case of silicon up to several hundred microns.

• DFG Programme: Major Research Instrumentation
• Major Instrumentation: ICP-RIE-Plasmaätzanlage
• Instrumentation Group: 0920 Atom- und Molekularstrahl-Apparaturen
• Applicant Institution: Ruprecht-Karls-Universität Heidelberg
• Leader: Professor Dr. Christian Walter Dietrich Enss